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pro vyhledávání: '"Udo Geckele"'
Autor:
Thomas Blank, Hongpeng Zhang, Felix Steiner, Dai Ishikawa, Udo Geckele, Ivan Peric, Helge Wurst, Benjamin Leyrer
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
The mechanical behavior of Al 2 O 3 -DCB and Si 3 N 4 -AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles (LL-TSC) from −40°C to +200 °C is presented. SiC-MOSFET dice from two different vendors a