Zobrazeno 1 - 10
of 65
pro vyhledávání: '"U. Streller"'
Publikováno v:
Applied Surface Science. 136:331-337
An XPS study of GaAs wafers etched by exposure to vacuum ultraviolet light in a Cl 2 atmosphere reveals a strong wavelength dependence of the desorption of reaction products. While the etching depth is not influenced by shifting the cut-off wavelengt
Publikováno v:
Superlattices and Microstructures. 23:445-451
Light-induced dry etching of Si(100) in the VUV range using synchrotron radiation (SR) and a halogen-containing gas (XeF2) has been investigated with respect to selectivity, anisotropy, quantum efficiency, optimal wavelength, spatial resolution and q
Publikováno v:
Applied Surface Science. :442-448
Light induced dry etching using synchrotron radiation (SR) in the VUV range and chlorine as etching gas has been applied to metals (Cu) and semiconductors (GaAs). High quality replica of a mask are etched by irradiation with filtered radiation and th
Publikováno v:
Applied Surface Science. 106:341-346
Replica of a mask were etched in Si(100) wafers with a sub-micrometer lateral resolution by VUV irradiation using XeF2. A high selectivity is achieved if the spontaneous reaction of XeF2 is suppressed by a buffer gas and if the unselective light indu
Publikováno v:
Journal of Electron Spectroscopy and Related Phenomena. 80:49-54
Light induced dry etching of metals (Cu) and semiconductors (GaAs, Si) using synchrotron radiation (SR) in the VUV range and halogen containing gases (Cl 2 , XeF 2 ) has been investigated and the conditions for selective and anisotropic etching are d
Publikováno v:
Applied Surface Science. :448-452
The photon-induced dry etching of Si(100) using synchrotron radiation (SR) in the VUV range and a halogen containing gas (XeF 2 ) has been investigated. Replica of a mask are etched in Si wafers with a sub-micrometer lateral resolution by irradiation
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 97:412-415
The selectivity and anisotropy of dry etching using synchrotron radiation (SR) in the vacuum ultraviolet (VUV) range (100 nm≤ λ ≤ 300 nm) has been investigated for semiconductors (GaAs, Si) in different etching gas atmospheres (Cl2, XeF2). For G
Autor:
U. Streller, J. Griesche, Karin Jacobs, A Schutzgen, H. Babucke, N. Hoffmann, Fritz Henneberger
Publikováno v:
Semiconductor Science and Technology. 10:201-207
ZnSe/ZnMnSe MQW structures are grown by MBE. In situ RHEED control allows one to lock the growth cycle on the phase of the RHEED oscillations so that lattice plane completion is achieved independent of beam flux fluctuations and other irregularities.
Autor:
Nikolaus Schwentner, B. Li, I. Twesten, U. Streller, H.-P. Krause, Yu. Poltoratskii, V. Stepanenko
Publikováno v:
Applied Surface Science. 86:577-581
Quantum efficiency for etching corresponding to the removal of more than 50 Ga and As atoms per incident photon is observed in the spectral range from 115 to 130 nm, which exceeds the values at long wavelengths by four orders of magnitude. Replica of
Publikováno v:
Journal of Applied Physics. 77:350-356
Replicas of a mask are etched in Si wafers with a micrometer lateral resolution and typical depths of 200 nm by irradiation with filtered synchrotron radiation using cutoff wavelengths of 105, 122, and 150 nm. An excellent selectivity and anisotropy