Zobrazeno 1 - 10
of 22
pro vyhledávání: '"U. Hodel"'
Autor:
Harald Gossner, Jung-Hoon Chun, M. Tiebout, Robert W. Dutton, W. Soldner, D. Schmitt-Landsiedel, Martin Streibl, C. Ito, U. Hodel
Publikováno v:
Scopus-Elsevier
The present work is focussed on the trade off between conventional RF ESD protection concepts optimized in terms of capacitive load and the frequently discussed RF ESD codesign idea with ESD protection skilfully integrated into RF circuit design. A n
Publikováno v:
Physical Review B. 54:17888-17895
Publikováno v:
Review of Scientific Instruments. 67:2269-2273
We describe a combined ultrahigh vacuum scanning tunneling microscope (STM)–scanning electron microscope (SEM) system, which allows to position the STM tip with respect to the sample within an area of 5 mm×5 mm under SEM control. While the SEM res
Publikováno v:
IEEE Photonics Technology Letters. 11:117-119
The optoelectronic dc and RF behaviour of an InAlAs-InGaAs optically controlled field-effect transistor based on a high electron mobility transistor layer structure is investigated at 1.3-/spl mu/m wavelength light. The device is backside-illuminated
Publikováno v:
Fresenius' Journal of Analytical Chemistry. 358:77-79
A combined ultrahigh vacuum scanning tunneling-scanning electron microscope system is presented. This system allows to approach arbitrary locations on a sample within a range of 5 mm × 5 mm under electron microscopic control. The usefulness of this
Integration of high-performance, low-leakage and mixed signal features into a 100 nm CMOS technology
Autor:
Thomas Schafbauer, S. Sportouch, Baozhen Li, Pak Leung, Y. H. Lin, Yi-Cheng Chen, Yimin Huang, Phung T. Nguyen, Chuan Lin, Shih-Fen Huang, Ming-Tsan Lee, A. Olbrich, Philipp Riess, J. Brighten, G. Knoblinger, Andy Cowley, U. Hodel, A. Grassmann, W. Nissl, Dirk Vietzke, Kun-Chi Lin, Larry Clevenger, Kai Esmark, Robert C. Wong, Hsiang-Jen Huang, C. Wann, M. Commons, Alan J. Leslie, T. Schiml, Martin Wendel, Qiuyi Ye, Erdem Kaltalioglu, Nivo Rovedo, Alvin G. Thomas
Publikováno v:
2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
Low voltage operation in sub-0.25 /spl mu/m requirements mean that the simultaneous integration of all components on a single chip - high performance, low leakage and mixed-signal components - is crucial. In this paper, we present the successful inte
Autor:
A. Fox, A. v. d. Hart, A. Orzati, Hans Lüth, Peter Kordos, O.J. Homan, Michel Marso, A. Förster, U. Hodel
Publikováno v:
Conference Proceedings. 2000 International Conference on Indium Phosphide and Related Materials (Cat. No.00CH37107).
We present a novel InAlAs/InGaAs layer structure for monolithically integrating MSM diodes and HEMTs into an photoreceiver. The novel layer system, grown on semiinsulating InP, consists of a typical HEMT layer sequence with an additional lattice matc
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 15:1364
The melting, eutectic alloy formation, and evaporation, induced locally by a scanning tunneling microscope, was studied for 20 nm Ag films, deposited on hydrogen-terminated Si(100) surfaces. The Ag thin film can be locally rearranged or evaporated wi
Conference
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Akademický článek
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