Zobrazeno 1 - 5
of 5
pro vyhledávání: '"U. Balda-Irurzun"'
Autor:
N. B. Palacios-Aguilera, U. Balda-Irurzun, Paddy J. French, H.A. Visser, Ashok Sridhar, L. D. Vargas-Llona, Andre Bossche, Remko Akkerman, Jiang Zhou
Publikováno v:
IEEE transactions on device and materials reliability, 13(1), 136-145. IEEE
IEEE Transactions on Device and Materials Reliability, 1, 13, 136-145
IEEE Transactions on Device and Materials Reliability, 1, 13, 136-145
Shapeable rechargeable Li-ion batteries are a good option for the power source of system-in-package devices; nevertheless, their size and temperature limitations are a constraint during the fabrication process. Inkjet-printed interconnections on top
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3df3031feb88e751a8fdcc628a19540a
https://research.utwente.nl/en/publications/92718b9d-c2e8-4fcb-9ec1-abfae83a3d33
https://research.utwente.nl/en/publications/92718b9d-c2e8-4fcb-9ec1-abfae83a3d33
Autor:
H.A. Visser, U. Balda-Irurzun, Remko Akkerman, Andre Bossche, L. D. Vargas-Llona, N. B. Palacios-Aguilera, Ashok Sridhar
Publikováno v:
University of Twente Research Information (Pure Portal)
4th Electronic System-Integration Technology Conference (ESTC)
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
4th Electronic System-Integration Technology Conference (ESTC)
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
Inkjet printing is widely being researched as enabling technology for printed electronics; however, there are scarce publications concerning the reliability of inkjet-printed structures on different substrates. The reliability of such structures unde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::81c0f88db03f25b67948ba91f020376c
https://doi.org/10.1109/estc.2012.6542111
https://doi.org/10.1109/estc.2012.6542111
Akademický článek
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Conference
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Publikováno v:
IEEE Transactions on Device & Materials Reliability; Mar2013, Vol. 13 Issue 1, pC1-C4, 4p