Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Tzvy-Jang Tseng"'
Autor:
Ning Liu, Chia-Yu Peng, Eagle Lin, Curry Lin, Leo Chang, Puru Bruce Lin, Tim Xia, Tzvy-Jang Tseng, John H. Lau, Kai-Ming Yang, Tzu Nien Lee, Show May Chiu, Cheng-Ta Ko
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:739-747
In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55b9d6c8baeec5aced5dfb91bfbd0240
https://doi.org/10.1109/tcpmt.2021.3070579
https://doi.org/10.1109/tcpmt.2021.3070579
Autor:
Yan-Jun Fan, John H. Lau, Kai-Ming Yang, Hsing-Ning Liu, Tzvy-Jang Tseng, Eagle Lin, Puru Bruce Lin, Curry Lin, Leo Chang, Jean-Jou Chen, Po-Chun Huang, Cheng-Ta Ko, Tim Xia, Winnie Lu, Chia-Yu Peng
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:29-39
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b8a304f5b03066bbe5ed60b583c39ef
https://doi.org/10.4071/imaps.1419800
https://doi.org/10.4071/imaps.1419800
Autor:
Tim Xia, David Cheng, Kai-Ming Yang, Yan-Jun Fan, Puru Bruce Lin, Tzvy-Jang Tseng, John H. Lau, Winnie Lu, Cheng-Ta Ko, Chia-Yu Peng, Curry Lin, Leo Chang, Hsing Ning Liu, Eagle Lin
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:67-80
In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a print
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::462aa0ceca7feed717806ec4f7862fcc
https://doi.org/10.4071/imaps.1421341
https://doi.org/10.4071/imaps.1421341
Autor:
John H. Lau, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Eagle Lin, Leo Chang, Hsing Ning Liu, Curry Lin, David Cheng, Winnie Lu
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 17:111-120
In this study, the design, materials, process, assembly, and reliability of a six-side molded panel-level chip-scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the redistribution layers (RDLs) of the PLCSP on a large temp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f97c82b7c0e476e82cade1f0484b4ac
https://doi.org/10.4071/imaps.1226533
https://doi.org/10.4071/imaps.1226533
Autor:
Tzvy-Jang Tseng, John H. Lau, Tim Xia, Chia-Yu Peng, Kai-Ming Yang, Po-Chun Huang, Cheng-Ta Ko, Puru Bruce Lin, Jean-Jou Chen, Eagle Lin, Winnie Lu, Curry Lin, Leo Chang
Publikováno v:
International Symposium on Microelectronics. 2020:000042-000050
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::639c9ce0320694dbb789cf22ab6a5643
https://doi.org/10.4071/2380-4505-2020.1.000042
https://doi.org/10.4071/2380-4505-2020.1.000042
Autor:
Eagle Lin, Kai-Ming Yang, John H. Lau, Curry Lin, Leo Chang, Puru Bruce Lin, David Cheng, Tim Xia, Winnie Lu, Hsing Ning Liu, Chia-Yu Peng, Tzvy-Jang Tseng, Cheng-Ta Ko
Publikováno v:
International Symposium on Microelectronics. 2020:000057-000066
In this study, the design, materials, process, assembly, and reliability of a 6-side molded panel-level chip scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the RDLs (redistribution layers) of the PLCSP on a large tempor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2e5d95c197a5b5390a5385f12cd8f43
https://doi.org/10.4071/2380-4505-2020.1.000057
https://doi.org/10.4071/2380-4505-2020.1.000057
Autor:
Curry Lin, Leo Chang, John H. Lau, Tzvy-Jang Tseng, Chia-Yu Peng, Eagle Lin, Ning Liu, Kai-Ming Yang, Tim Xia, Tzu Nien Lee, Puru Bruce Lin, Cheng-Ta Ko, Show May Chiu
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b94b63f6050ade95d2420ab3f0ae1612
https://doi.org/10.1109/ectc32696.2021.00045
https://doi.org/10.1109/ectc32696.2021.00045
Autor:
Puru Bruce Lin, Jean-Jou Chen, John H. Lau, Cheng-Ta Ko, Po-Chun Huang, Curry Lin, Yan-Jun Fan, Leo Chang, Kai-Ming Yang, Tim Xia, Chia-Yu Peng, Winnie Lu, Eagle Lin, Hsing-Ning Liu, Tzvy-Jang Tseng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip and two smaller chips by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a panel is investigated. Emphasis is placed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2eb964bfd7afa7a2f47dd5d5c3156c65
https://doi.org/10.1109/ectc32696.2021.00067
https://doi.org/10.1109/ectc32696.2021.00067
Autor:
Hsing Ning Liu, Puru Bruce Lin, Winnie Lu, Tzvy-Jang Tseng, Curry Lin, Leo Chang, Yan-Jun Fan, John H. Lau, Cheng-Ta Ko, Eagle Lin, David Cheng, Tim Xia, Kai-Ming Yang, Chia-Yu Peng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a 6-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\leftrightarrows 125^{\circ}\mathrm{C}$ , 50-minute
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2e78774b4003e2e3b3e8d2bfe47f67d
https://doi.org/10.1109/ectc32696.2021.00148
https://doi.org/10.1109/ectc32696.2021.00148
Autor:
Channing Cheng-Lin Yang, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Hsing-Ning Liu, Tzvy-Jang Tseng, John H. Lau, Ricky Tsun-Sheng Chou
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The fan-out panel-level chip-last packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, and fabrication of: (a) the heterogeneous integration of one large chip and one small chip with 50µm-pit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93293caa3523413b885c90eea57641ac
https://doi.org/10.1109/ectc32696.2021.00035
https://doi.org/10.1109/ectc32696.2021.00035