Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Tzuchun Hung"'
Autor:
Liwen Guo, Tzuchun Hung, Cheng-Hua Huang, Minghua Duan, Chiming Jao, Vinson Lin, Robert Yuan, Dechao Kong, Hai Du, Xiaojin Fan, Dong Xun, Jun Zhang, Min Wu, Wenqing Lv, Carrie Chen, Candy He, Nishi Ahuja, Qing Qiao
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60c1db908409bb65ba87ee7fabaaa1f0
https://doi.org/10.1109/itherm54085.2022.9899539
https://doi.org/10.1109/itherm54085.2022.9899539
Autor:
Jiajun Zhang, Feng Deng, Sean Kuo, Vinson Lin, Gang Chen, Min Wu, Jun Zhang, Chiming Jao, Jialiang Xu, Hechun Zhang, Tzuchun Hung, Jie Zhao, Dan Liu, Carrie Chen, Robert Yuan, Jiahong Wu, Liwen Guo, Minghua Duan, Chris Du, Chao Zhou, Yuyang Xia, Candy He, Xiaojin Fan, Lianjun Zhao, Zhenghui Wu, Hongmei Liu, Feng Jiang
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Along with quickly emerging applications, including 5G, IOT (Internet of Things), Auto Piloting, etc., in industry, demands for local large-scale data analysis and AI (Artificial Intelligence) processing on edge is growing rapidly. As a result, hardw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f89102c267da04cab92e759b1666a6bc
https://doi.org/10.1109/itherm45881.2020.9190230
https://doi.org/10.1109/itherm45881.2020.9190230