Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tzu-Yin Wei"'
Autor:
Tzu-Yin Wei, 魏慈吟
107
The demand for second foreign language courses in senior high schools has grown substantially over the past two decades, in large part due to globalization. This study, therefore, sought to determine whether significant differences exist bet
The demand for second foreign language courses in senior high schools has grown substantially over the past two decades, in large part due to globalization. This study, therefore, sought to determine whether significant differences exist bet
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/424fvv
Autor:
Chih-Min Liu, Ming-En Hsieh, Yu-Feng Hu, Tzu-Yin Wei, I-Chien Wu, Pei-Fen Chen, Yenn-Jiang Lin, Satoshi Higa, Nobumori Yagi, Shih-Ann Chen, Vincent S. Tseng
Publikováno v:
Circulation. Cardiovascular quality and outcomes. 15(8)
Background: Concealed left ventricular hypertrophy (LVH) is a prevalent condition that is correlated with a substantial risk of cardiovascular events and mortality, especially in young to middle-aged adults. Early identification of LVH is warranted.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2106d72ec00b315a36ebebf199f6e07a
https://pubmed.ncbi.nlm.nih.gov/35959675
https://pubmed.ncbi.nlm.nih.gov/35959675
Autor:
Chih-Min Liu, Ming-En Hsieh, Yu-Feng Hu, Tzu-Yin Wei, I-Chien Wu, Pei-Fen Chen, Yenn-Jiang Lin, Satoshi Higa, Shih-Ann Chen
Publikováno v:
Heart Rhythm. 19:S170
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff7a2cba7783e8ad4d1af805b305de3e
https://doi.org/10.1016/j.hrthm.2022.03.906
https://doi.org/10.1016/j.hrthm.2022.03.906
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
SiP (System in Package) module products are always a focus of USI’s R&D efforts. USI’s efforts in module development have been focused on wireless modules since 2000, including WiFi, Bluetooth, GPS and WWAN (GSM/WCDMA/LTE). Products have been pou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::031a74be5df835151e13f43c100e494b
https://doi.org/10.1109/impact47228.2019.9024977
https://doi.org/10.1109/impact47228.2019.9024977
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Electronic products are becoming lighter, thinner and more compact as the diversity of product grows and functions become more powerful. As a result, the size of Surface Mount Devices (SMDs) used for the Surface Mount Technology (SMT) become smaller
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41bd2b60e99e9a2453c7b235a363b35d
https://doi.org/10.1109/impact.2016.7800005
https://doi.org/10.1109/impact.2016.7800005