Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Tzu-Nien Lee"'
Autor:
Tzu-Nien Lee, John-H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Kai-Ming Yang, Puru-Bruce Lin, Chia-Yu Peng, Leo Chang, Jia-Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng
Publikováno v:
Materials, Vol 15, Iss 7, p 2396 (2022)
In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is pl
Externí odkaz:
https://doaj.org/article/a7325ed4b3bb49e9871dd6caee5ba862
Autor:
Tzu-Nien Lee, 李子念
101
In this thesis, the SAM/SiO2 stacked sensing membrane was used to improve the sensing characteristic of ISFETs. In our results, the sensitivity, hysteresis and drift of EIS with the SAM/SiO2 stacked sensing membrane were all improved. Beside
In this thesis, the SAM/SiO2 stacked sensing membrane was used to improve the sensing characteristic of ISFETs. In our results, the sensitivity, hysteresis and drift of EIS with the SAM/SiO2 stacked sensing membrane were all improved. Beside
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/45925080917437867195
Autor:
Tony Chia-Yu Peng, John H. Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Bruce Puru Lin, Tim Xia, Leo Chang, Hsing-Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:469-478
Autor:
Chia-Yu Peng, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wang, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
International Symposium on Microelectronics. 2021:000217-000223
In this study, a high-density organic hybrid substrate for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and characterization of the hybrid substrate with an interconnect-layer.
Autor:
Ning Liu, Chia-Yu Peng, Eagle Lin, Curry Lin, Leo Chang, Puru Bruce Lin, Tim Xia, Tzvy-Jang Tseng, John H. Lau, Kai-Ming Yang, Tzu Nien Lee, Show May Chiu, Cheng-Ta Ko
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:739-747
In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED
Publikováno v:
IEEE Transactions on Electron Devices. 67:3761-3766
This study addressed the characteristics of electrolyte–insulator–semiconductor (EIS) pH sensors with array wells and sensing membrane stacks of 3-aminopropyltriethoxysilane (APTES)/SiO2. The arrays of square wells were fabricated by nanoimprint
Autor:
Tzu Nien Lee, John H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Henry Kai-Ming Yang, Puru Bruce Lin, Tony Chia-Yu Peng, Leo Chang, Jia Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng
Publikováno v:
2021 IEEE CPMT Symposium Japan (ICSJ).
Autor:
Chia-Yu Peng, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Henry Kai-Ming Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
2021 IEEE CPMT Symposium Japan (ICSJ).
Autor:
Curry Lin, Leo Chang, John H. Lau, Tzvy-Jang Tseng, Chia-Yu Peng, Eagle Lin, Ning Liu, Kai-Ming Yang, Tim Xia, Tzu Nien Lee, Puru Bruce Lin, Cheng-Ta Ko, Show May Chiu
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:Q158-Q163
This study focuses on the characteristics of polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) with n-type line-array doping channels manufactured by nanoimprint lithography. Array doping patterns with a line width/space of approximately