Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Tzu-Heng Hung"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 11, Pp 473-479 (2023)
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation. XRD ana
Externí odkaz:
https://doaj.org/article/3ea4d3d903b24f3bbbb06894c9be0536
Publikováno v:
Memories - Materials, Devices, Circuits and Systems, Vol 4, Iss , Pp 100024- (2023)
The stress of TSV with different dimensions under annealing condition has been investigated. Since the application of TSV and bonding technology has demonstrated a promising approach for vertical connection in HBM stacking, the stress caused by Cu TS
Externí odkaz:
https://doaj.org/article/3f53c6bf2172485bb5723a22ae1d7c99
Publikováno v:
Nanomaterials, Vol 13, Iss 17, p 2490 (2023)
Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu) bond
Externí odkaz:
https://doaj.org/article/f1275610d72949668a22059170c2ca79
Publikováno v:
Developmental Dynamics. 251:846-863
The Hippo pathway is conserved through evolution and plays critical roles in development, tissue homeostasis and tumorigenesis. Yes-associated protein (YAP) is a transcriptional coactivator downstream of the Hippo pathway. Previous studies have demon
Autor:
Tzu-Heng Hung, Kuan-Neng Chen
Publikováno v:
2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT).
Autor:
Hsih-Yang Chiu, Han-Wen Hu, Tzu-Chieh Chou, Kuan-Neng Chen, Shih Chiang-Lin, Kang Ting-Cih, Shan-Yu Mao, Tzu-Heng Hung
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The main development challenge of low temperature hybrid bonding technology is the oxidation of Cu surface. The schemes to achieve the high-quality surface condition of Cu before bonding is urgently demanded. In this study, four acid solutions, inclu
Publikováno v:
Applied Surface Science. 576:151845
This study proposes to use highly (111)-oriented nanotwinned Ag films to achieve metal direct bonding under air atmosphere at bonding temperature of 190/200 oC in 3 min. The as-deposited Ag film exhibits strong (111) surface orientation and high dens
Autor:
Chen-Wei Jao1 (AUTHOR) foxrain.tw@msa.hinet.net, Tzu-Heng Hung2 (AUTHOR) u103003093@cmu.edu.tw, Chi-Fen Chang3 (AUTHOR) cfchang@mail.cmu.edu.tw, Ta-Hsien Chuang2,4 (AUTHOR) thchuang@mail.cmu.edu.tw
Publikováno v:
Molecules. Nov2016, Vol. 21 Issue 11, p1605. 10p. 3 Diagrams, 2 Charts.
Publikováno v:
Molecules; Volume 21; Issue 11; Pages: 1605
Molecules
Molecules
The partitioned n-hexane, CHCl3, and EtOAc extracts from the crude MeOH extract of Phaius mishmensis showed considerable cytotoxicities against the human breast carcinoma (MCF-7), lung carcinoma (NCI-H460), and central nervous system carcinoma (SF-26