Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Tzu Chen Wang"'
Autor:
Chia Chi Lee, Tzu Chen Wang, Hsin Yu Wang, Bin Hsu, Rong Jhen Shih, Neng Wen Lo, Chun Yuan Wang
Publikováno v:
Ophthalmic Research. 65:474-480
Introduction: In normal tension glaucoma (NTG), factors other than elevated intraocular pressure (IOP) are likely to play a role in the pathogenesis of optic neuropathy. The potential similarities between Alzheimer’s disease (AD) and NTG in cellula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b7c2856e1e5aad68c1a549f4e411e2b5
https://doi.org/10.1159/000524173
https://doi.org/10.1159/000524173
Publikováno v:
PERSIST-IoT@MobiHoc
Traditionally, deep learning acceleration mostly focuses on the trade-off between accuracy and training time but seldom addresses the deployment over hierarchical 5G networks to maximize the inference throughput. By contrast, computing offloading res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f3539b4171e68c996414cbf22000ae7
https://doi.org/10.1145/3331052.3332477
https://doi.org/10.1145/3331052.3332477
Publikováno v:
2018 IEEE International Interconnect Technology Conference (IITC).
Wafer bending effects on re-distribution layer (RDL) reliability in a multiple die package is examined using multiscale TCAD sub-modeling techniques. At the global scale, the wafer package with 200 dies and 3 RDL layers is analyzed with smear materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::556054d9cf5af5c14bad8f95b9636496
https://doi.org/10.1109/iitc.2018.8430421
https://doi.org/10.1109/iitc.2018.8430421
Publikováno v:
2017 IEEE International Interconnect Technology Conference (IITC).
Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Tempe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f05bafd87420ba69b744cd563793e9fb
https://doi.org/10.1109/iitc-amc.2017.7968957
https://doi.org/10.1109/iitc-amc.2017.7968957
Autor:
Kuei-Shu Chang-Liao, Chin-Lung Cheng, Chun-Yuan Lu, Bhabani Shankar Sahu, Tzu-Chen Wang, Tien-Ko Wang, Shang-Feng Huang, Wen-Fa Tsai, Chi-Fong Ai
Publikováno v:
IEEE Transactions on Electron Devices; Feb2007, Vol. 54 Issue 2, p233-240, 8p, 9 Black and White Photographs, 11 Graphs
Publikováno v:
IEEE Electron Device Letters; Mar2006, Vol. 27 Issue 3, p148-150, 3p, 4 Graphs
Publikováno v:
2006 International Symposium on VLSI Technology, Systems & Applications; 2006, p1-2, 2p