Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Tyler Dolmetsch"'
Autor:
Kazue Orikasa, Cheol Park, Sang-Hyon Chu, Calista Lum, Tony Thomas, Tyler Dolmetsch, Luiza Benedetti, Arvind Agarwal
Publikováno v:
npj 2D Materials and Applications, Vol 8, Iss 1, Pp 1-9 (2024)
Abstract Neutron radiation exposure is one of the main challenges faced during space missions. There is a critical need for advanced lightweight radiation shielding materials. Two-dimensional (2D) boron nitride nanoplatelets (BNNP) are excellent cand
Externí odkaz:
https://doaj.org/article/a4f5367d2f9a4a5abeedf441d491588d
Autor:
Fuad Hasan, Abderrachid Hamrani, Md Munim Rayhan, Tyler Dolmetsch, Dwayne McDaniel, Arvind Agarwal
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 8, Iss 5, p 222 (2024)
Thermal simulation is essential in wire-arc-directed energy deposition (W-DED) to accurately estimate temperature distributions, impacting residual stress and distortion in components. Proper calibration of simulation models minimizes inaccuracies ca
Externí odkaz:
https://doaj.org/article/8c95684ccdfc46a09b8b8aca28c2b8a7
Publikováno v:
ACS Applied Materials & Interfaces. 14:42876-42886
Autor:
Ambreen Nisar, Tyler Dolmetsch, Tanaji Paul, Tamil Selvan Sakthivel, Cheng Zhang, Benjamin Boesl, Sudipta Seal, Arvind Agarwal
Publikováno v:
Journal of the American Ceramic Society. 105:2500-2516
In-situ synthesis of Boron Nitride Nanotube reinforced aluminum oxide composites by molecular mixing
Publikováno v:
Ceramics International. 47:13970-13979
Boron Nitride Nanotube (BNNT)/Al2O3 composite powders were prepared by molecular mixing of aqueous nanotube dispersions and aluminum ions. The composite powder was consolidated by spark plasma sintering where the ceramic phase underwent phase transfo
Publikováno v:
Journal of the American Ceramic Society. 104:2483-2494
Autor:
Tanaji Paul, Lihua Lou, Pranjal Nautiyal, Tyler Dolmetsch, Cheng Zhang, Benjamin Boesl, Arvind Agarwal
Publikováno v:
SSRN Electronic Journal.
Publikováno v:
Advanced Engineering Materials. 22:2000170