Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Tyler, Osborn"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Traditional laser scribe which utilizes a nanosecond laser to ablate metal and interlayer dielectric layers (ILD) has been widely adopted by the microelectronics packaging industry as the gold standard for laser scribe processing in die prep singulat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::878f0040643b7bec3275cffb54c233df
https://doi.org/10.1109/ectc.2019.00075
https://doi.org/10.1109/ectc.2019.00075
Autor:
Brian Knapp, Paul A. Kohl, Tyler Osborn, Edmund Elce, Sue Ann Bidstrup Allen, C. Hunter Lightsey, Venmathy Rajarathinam
Publikováno v:
Journal of Electronic Materials. 38:778-786
The properties of a new aqueous-base-develop, negative-tone photosensitive polynorbornene have been characterized. High-aspect-ratio features of 7:1 (height:width) were produced in 70-μm-thick films in a single coat with straight side-wall profiles
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a94b96a3c684ef03b81661d122cc460
https://doi.org/10.1007/s11664-009-0741-3
https://doi.org/10.1007/s11664-009-0741-3
Publikováno v:
Microelectronic Engineering. 86:379-386
A novel fabrication technique using electroless copper deposition has been used to produce all-copper, chip-to-substrate connections. This process replaces solder by electrolessly joining copper pillars on the chip and substrate. The electroless copp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d599e671c79699b91c1af5a886c1308c
https://doi.org/10.1016/j.mee.2008.11.080
https://doi.org/10.1016/j.mee.2008.11.080
Publikováno v:
Israel Journal of Chemistry. 48:251-257
Platinum-ruthenium electrodes (PtxRu1-x) have been prepared by elec- trochemical and electroless deposition and investigated as catalysts for the oxidation of methanol in acidic solutions. PtxRu1-x deposits were electrochemically deposited from acidi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84638fccc6f900c88cb27038fe0e026b
https://doi.org/10.1560/ijc.48.3-4.251
https://doi.org/10.1560/ijc.48.3-4.251
Publikováno v:
ECS Transactions. 6:361-369
Thin film electrodes for a low power direct methanol fuel cell (DMFC) were prepared by incorporating carbon-supported Pt nanoparticles (Pt/C) into a silicon dioxide glass matrix. Scanning electron micrographs (SEM) indicate that the Pt/C was well dis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c90f281c6b79fca928b7d97a2e8b4437
https://doi.org/10.1149/1.2943256
https://doi.org/10.1149/1.2943256
Publikováno v:
Journal of Fuel Cell Science and Technology. 7
The electroless deposition of PtxRu1−x catalysts using hydrazine dihydrochloride or formic acid as the reducing agent in a modified Leaman bath was investigated. The effect of potential on the PtxRu1−x composition was investigated by potentiostat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4f08bc49f4bb493e74c01c79cc1c2be
https://doi.org/10.1115/1.4000675
https://doi.org/10.1115/1.4000675
Publikováno v:
Materials for Advanced Packaging ISBN: 9780387782188
Transistor scaling, shrinking the critical dimensions of the transistor, has led to continuous improvements in system performance and cost. Higher density of the transistors and larger chip size has also led to new challenges for chip-to-substrate co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cbd5d49d7e5e8d245ea3dcbc40cfebc
https://doi.org/10.1007/978-0-387-78219-5_3
https://doi.org/10.1007/978-0-387-78219-5_3
Publikováno v:
Science (New York, N.Y.). 320(5877)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::52953d47cf2e7a39e2ac1b85684e9422
https://pubmed.ncbi.nlm.nih.gov/18467580
https://pubmed.ncbi.nlm.nih.gov/18467580
Publikováno v:
2008 58th Electronic Components and Technology Conference.
A novel fabrication process has been developed and characterized to create all-copper chip-to-substrate input/output (I/O) connections. Electroless copper plating followed by low temperature annealing in a nitrogen environment was used to create an a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2aedef13bc972b4accd3407375ebcb93
https://doi.org/10.1109/ectc.2008.4549952
https://doi.org/10.1109/ectc.2008.4549952
Publikováno v:
Journal of The Electrochemical Society. 156:D226
A fabrication technique using electroless copper deposition has been used to produce all-copper chip-to-substrate connections. This process replaces solder by electrolessly joining copper pillars on a chip and substrate. Previously, solid copper-to-c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19703b2ec39114d37ce2e5c5dda2e933
https://doi.org/10.1149/1.3123288
https://doi.org/10.1149/1.3123288