Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology

Autor: Veale, Matthew C., Booker, P., Church, I., Jones, L. L., Lipp, J., Schneider, Andreas, Seller, Paul H., Wilson, Matthew D., Chsherbakov, Ivan, Kolesnikova, Irina I., Lozinskaya, Anastassiya D., Novikov, Vladimir A., Tolbanov, Oleg P., Tyazhev, Anton V., Zarubin, Andrei N.

Publikováno v: Nuclear instruments and methods in physics research Section A: accelerators, spectrometers, detectors and associated equipment. 2022. Vol. 1025. P. 166083 (1-9)

In this paper a new version of the HEXITEC spectroscopic imaging technology is presented. The HEXITEC ASIC maintains the same pixel electronics but, unlike the previous design, contains no I/O pads on the top surface of the ASIC. The I/O pads, used f

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______3810::5e56e6bc3e3b4aa167604b377ead9865
https://vital.lib.tsu.ru/vital/access/manager/Repository/koha:000997249

X-ray based methods for 3D characterization of charge collection and homogeneity of sensors with the use of Timepix chip.

Autor: Zemlicka, Jan, Jakubek, Jan, Jakubek, Martin, Vykydal, Zdenek, Chelkov, Georgy A., Kruchonok, Vladimir G., Elkin, Vladimir G., Fiederle, Michael, Fauler, Alex, Tolbanov, Oleg P., Tyazhev, Anton V., Visser, Jan

Publikováno v: 2011 IEEE Nuclear Science Symposium Conference Record; 1/ 1/2011, p4711-4714, 4p

THz waveguide with a spit ring resonators layer.

Autor: Nazarov, Maxim M., Shkurinov, Alexander P., Sarkisov, Sergey Yu., Zarubin, Andrey V., Tyazhev, Anton V., Tolbanov, Oleg P., Dunaevsky, Grigory E.

Publikováno v: 2014 39th International Conference on Infrared, Millimeter & Terahertz waves (IRMMW-THz); 2014, p1-2, 2p