Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Tusher Ahmed"'
Autor:
Mitisha Surana, Ganesh Ananthakrishnan, Matthew M. Poss, Jad Jean Yaacoub, Kaihao Zhang, Tusher Ahmed, Nikhil Chandra Admal, Pascal Pochet, Harley T. Johnson, Sameh Tawfick
Publikováno v:
Nano Letters. 23:1659-1665
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f91520583041ea0ff7b9b9c2eaa6f067
https://doi.org/10.1021/acs.nanolett.2c03911
https://doi.org/10.1021/acs.nanolett.2c03911
Publikováno v:
Journal of Electronic Materials. 50:233-248
Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density across flip-chip solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f936e8cb64fe720d05bd7a83db840bee
https://doi.org/10.1007/s11664-020-08514-y
https://doi.org/10.1007/s11664-020-08514-y
Publikováno v:
Acta Materialia. 240:118340
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28da9fa2392052aa0974e57acfd2cebe
https://doi.org/10.1016/j.actamat.2022.118340
https://doi.org/10.1016/j.actamat.2022.118340
Publikováno v:
Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019).
Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b82efd426a97a2ffccb0f5630bec555
https://doi.org/10.1063/5.0039955
https://doi.org/10.1063/5.0039955
Publikováno v:
Journal of the Mechanics and Physics of Solids. 163:104831
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2af206fe99fa6c595ad8be4d44836448
https://doi.org/10.1016/j.jmps.2022.104831
https://doi.org/10.1016/j.jmps.2022.104831
This study investigated the effect of plant age on the nutrients of jute leaves [Corchorus capsularis (CVL-1)]. Jute seeds were sown on Jute Seed Production and Research Centre, Bangladesh Jute Research Institute (BJRI), Nashipur, Dinajpur, Banglades
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0af668815504e86ec02fa666a9d19730
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fa7ffa51e1ee28d308f44090afac009
https://doi.org/10.1115/ipack2019-6521
https://doi.org/10.1115/ipack2019-6521
Publikováno v:
AIP Conference Proceedings.
In modern electronic packaging industries, plastic ball grid array (PBGA) has been widely used as the microprocessor components. Upon thermal cycling due to the generation of thermal stresses, the PBGA package may undergo fatigue failure in the solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e21cbfdda920cf96d1fb3049268116a7
https://doi.org/10.1063/1.5044301
https://doi.org/10.1063/1.5044301
Publikováno v:
AIP Conference Proceedings.
Energy harvesting technology has the ability to create self-powered electronic systems that do not rely on battery power for their operation. Wind energy can be converted into electricity via a piezoelectric transducer during the air flow over a cyli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe8a791e6f54ac616914d1dd8988e381
https://doi.org/10.1063/1.4984705
https://doi.org/10.1063/1.4984705
Autor:
Motalab, Mohammad Abdul, Ahmed, Md. Tusher, Bappy, Md. Omarsany, Alam, Muhammad Mahbubul, Rahman, Muhammad Ashiqur, Ali, Mohammad
Publikováno v:
AIP Conference Proceedings; 2020, Vol. 2324 Issue 1, p1-10, 10p