Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Tuomin Tao"'
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 70:2271-2282
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 65:564-573
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 69:3490-3500
Autor:
Hanzhi Ma, Da Li, Tuomin Tao, Xingjian Shangguan, En-Xiao Liu, Jose Schutt-Aine, Andreas C. Cangellaris, Er-Ping Li
Publikováno v:
IEEE Transactions on Signal and Power Integrity. 1:160-169
Publikováno v:
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Autor:
Aili Wang, Manareldeen Ahmed, Tuomin Tao, Er-Ping Li, Hang Jin, Shurun Tan, Hanzhi Ma, En-Xiao Liu, Quankun Chen, Zheming Gu
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 68:1906-1916
This article presents a novel circuit modeling method for online training and testing process of the neuromorphic chip crossbar array based on the resistive random access memory (RRAM). A modified RRAM compact model is developed to realize the fast a
Publikováno v:
2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).
Publikováno v:
2021 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium).
Publikováno v:
2021 13th Global Symposium on Millimeter-Waves & Terahertz (GSMM).
Ground vias are often used as an essential shielding structure in System-in-Package (SiP) to suppress electromagnetic leakage. In this paper, a new method based on Convolutional Neural Network (CNN) is adopted to predict the shielding effectiveness o
Publikováno v:
2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO).
This paper presents the shielding effectiveness (SE) of the ground vias in conformal-shielded System-in-Package (SiP) by analyzing three main radiation leak paths separately. The SE of the ground vias can be submerged by radiation from those three pa