Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Tunga Krishna R"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
There is an increasing need for a low cost solution to increase the speed and functionality of microprocessors. Decoupling capacitors mounted on the organic substrate close to the processor chip serve this purpose. Tin-Silver-Copper based solder mate
Autor:
Tunga Krishna R, R. Mendelson, I. Melville, J. Coffin, E. Misra, C. Carey, Thomas A. Wassick, David Questad, Christopher D. Muzzy
Publikováno v:
International Symposium on Microelectronics. 2015:000787-000792
The introduction of low-k & ultra-low-k dielectrics, lead-free (Pb-free) solder interconnects or C4's, and organic flip-chip laminates for integrated circuits have led to some major reliability challenges for the semiconductor industry. These include
Autor:
Joseph C. Ross, Catherine Dufort, Kamal K. Sikka, Eric Turcotte, Thomas E. Lombardi, David Turnbull, Tunga Krishna R, Bakul Parikh
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Decoupling capacitors are increasingly being used to decrease signal latency and to increase the speed and functionality of microprocessors used in ASICs and Server applications. SnAgCu (SAC) based solder joints are typically used to attach the capac
Publikováno v:
Journal of Electronic Packaging. 139
Fine pitch interconnects when used with two-dimensional (2D)/2.5D packaging technology offer enormous potential toward decreasing signal latency and by making it possible to package increased electrical functionality within a given area. However, fin
Publikováno v:
IM
This paper presents our initial efforts towards building a cognitive analytics framework for change management. We propose a novel predictive algorithm for change risk calculation based on historical change failures, server failures, change triggered
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Fine pitch interconnects combined with 2.5D/3D packaging technology offers enormous potential towards decreasing signal latency and by making it possible to package increased electrical functionality within a given area. However, fine pitch interconn
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This study is focused on geometric optimization of a 2.5D interposer based single die flip-chip package. Parametric analyses using the well-established global-local finite element method (FEM) technique have been conducted on the package at both the
Autor:
Suresh K. Sitaraman, Tunga Krishna R
Publikováno v:
Microelectronics Reliability
A laser moire interferometry based technique to predict the fatigue life of Sn4.0Ag0.5Cu solder joints in a plastic ball grid array (PBGA) package when subjected to a typical accelerated thermal cycling (ATC) loading has been presented in this paper.
Autor:
Suresh K. Sitaraman, Tunga Krishna R
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:84-97
A fatigue model to predict the number of cycles for crack initiation and crack growth rate in Sn4.0Ag0.5Cu solder joints used in plastic ball grid array packages when subjected to accelerated thermal cycling has been developed. In addition to the con
Autor:
Tunga Krishna R, Suresh K. Sitaraman
Publikováno v:
Experimental Mechanics. 48:355-365
There is a compelling need to experimentally understand solder joint deformation behavior at high temperatures over an extended period of time. Accordingly, the deformation behavior of solder joints in a Ceramic Ball Grid Array (CBGA) package mounted