Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Tung-Bao Lu"'
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Nowadays, copper bump is often used in driver IC which usually used in high current density environment. High current density leads to electromigration. Therefore, the main objective of this paper is reliability analysis, including observing the chan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fce94986ee2728f2c3c99be999f24786
https://doi.org/10.23919/icep.2017.7939441
https://doi.org/10.23919/icep.2017.7939441
Publikováno v:
2015 Asia-Pacific Microwave Conference (APMC).
In this paper, the main purpose is reliability analysis. To find what kinds of environment will impact the inner structure of sample. Two of the objective is emerged from this study. First, electro-migration in sample under high current density has b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c193c64e1a5df4188ee86d703613e17
https://doi.org/10.1109/apmc.2015.7411701
https://doi.org/10.1109/apmc.2015.7411701