Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Tung‐Huan Chou"'
Publikováno v:
Surface and Interface Analysis. 54:864-872
Publikováno v:
Materials Science Forum. 928:215-220
The microstructures of Co–GaSb junctions in samples annealed at 300, 400, 500, and 600°C in a N2atmosphere were characterized using transmission electron microscopy (TEM) in combination with energy-dispersive spectrometry (EDS), nanobeam electron
Autor:
Wen-Kuan Yeh, An-Ni Dai, Wenqi Zhang, Po-Ying Chen, Yi-Lin Yang, Cheng-Li Lin, Tung-Huan Chou, Kwang-Jow Gan, Kehuey Wu, Chia-Hung Shih
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 16:610-616
In this paper, the impact of width quantization on device characteristic and stressing induced device degradation for high-k/metal tri-gate n/p-type FinFET was investigated well including electrical characteristic clarification and simulation. Carrie
Publikováno v:
IEEE Transactions on Nanotechnology. 14:330-337
In this study, we investigate the impact of junction doping distribution (LDD/halo) on variations and asymmetry of device characteristics for fully depleted silicon on insulator (FDSOI) with ultrathin buried oxide layer nMOSFET. The device performanc
Autor:
Shou-Yi Chang, Chen Tai-Sheng, Hong-Jen Lai, Ming-Sheng Leu, Jin-Bao Wu, Yi-Ching Huang, Tung-Huan Chou, Ding-Shiang Wang
Publikováno v:
Scientific Reports
Scientific Reports, Vol 7, Iss 1, Pp 1-10 (2017)
Scientific Reports, Vol 7, Iss 1, Pp 1-10 (2017)
This study reports a mechanical stress-based technique that involves scratching or imprinting to write textured graphite conducting wires/patterns in an insulating amorphous carbon matrix for potential use as interconnects in future carbonaceous circ
Publikováno v:
IEEE Transactions on Electron Devices. 54:531-536
In this paper, we have successfully fabricated poly-Si-oxide-nitride-oxide-silicon (SONOS)-type poly-Si-thin-film transistor (TFT) memories employing hafnium silicate as the trapping layer with low-thermal budget processing (les600degC). It was demon
Publikováno v:
IEEE Electron Device Letters. 28:267-269
In this letter, we fabricated the poly-Si-oxide-nitride-oxide-silicon (SONOS)-type Flash memories on polycrystalline-silicon thin films and found that dangling bonds presented along the grain boundaries in the channel significantly influence their re
Autor:
Wei-Shang Hsieh, Chang-Hong Shen, Cheng-Hui Tu, Tung-Huan Chou, Min-Cheng Chen, Wen-Hsien Huang, Fu-Liang Yang, Chenming Hu, Jia-Min Shieh, Chieh Wang, Ci-Ling Pan, Jung Y. Huang, Yu-Chung Lien, Yinchieh Lai
Publikováno v:
2012 International Electron Devices Meeting.
For the first time, a sequentially processed 3D hybrid chip is demonstrated by stacking low-temperature (LT) Ferroelectric-like (FE-like) metal-oxide nonvolatile memory (NVM) and CMOS. The high-mobility (333 and 113 cm2/V-s) and low-subthreshold swin
Publikováno v:
2012 International Symposium on Computer, Consumer and Control.
In this paper, we fabricated the poly-SiiVoxideiVnitrideiVoxideiVsilicon (SONOS)-type Flash memories on polycrystalline-silicon thin films. Employing a powerful defect passivation technique, i.e., NH3 plasma treatment, the charge storage capability w
Publikováno v:
Springer Proceedings in Physics ISBN: 9781402086144
We have used front-wing conductive probes to investigate the factors that most obviously influence the stability of scanning capacitance spectroscopy (SCS). Photoperturbations and environmental humidity are the dominant factors influencing SCS stabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9d3801144213dc91194aa9f038e412c
https://doi.org/10.1007/978-1-4020-8615-1_100
https://doi.org/10.1007/978-1-4020-8615-1_100