Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Tue Ravnkilde"'
Autor:
Tue Ravnkilde, Roberto Frosio, Henri Vuillomenet, Henning Henningsen, Gregoire Perregaux, Jean-Philippe Thiébaud, Stephan Gonseth, Carsten Underbjerg, Patrick Debergh
Publikováno v:
Microsystem Technologies. 11:1171-1175
The present paper describes the development of contactless optical microshutter arrays, which are mounted in an assembly of microlenses, optical fibers and driving electronics. In the past, complete systems have been made, for different applications,
Publikováno v:
Journal of Micromechanics and Microengineering. 15:873-882
This work investigates the isotropic etching properties of an inductively coupled plasma (ICP) etcher for masked and maskless etching steps in reference to fabrication of a silicon microlens mold. Using the described method a wide range of lens geome
Autor:
Anette Alsted Rasmussen, Kristian Pontoppidan Larsen, Morten Ginnerup, Ole Hansen, Jan Tue Ravnkilde
Publikováno v:
Sensors and Actuators A: Physical. 103:156-164
In situ bending test devices with integrated electrostatic actuator were fabricated in electroplated nanocrystalline nickel. The device features approximately pure in-plane bending of the test beam. The excitation of the test beam has fixed displacem
Publikováno v:
Sensors and Actuators A: Physical. 92:242-248
The magnetic properties of pulse reverse (PR) electroplated CoNiFe and DC electroplated NiFe are presented. CoNiFe is a very promising material for magnetic microsystems due to the possibility of achieving a high saturation flux density (Bs) and a lo
Publikováno v:
Sensors and Actuators A: Physical. 83:156-160
Electrodeposition of photoresist on highly structured surfaces is combined with electroplating to fabricate three new types of advanced 3D metal microstructures. In one application, electroplated nickel cantilever arrays are formed on the sloped side
Publikováno v:
Larsen, K P, Ravnkilde, J T & Hansen, O 2003, SOI silicon on glass for optical MEMS . in Proceedings of the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) . IEEE, pp. 1655-1658, 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Boston, United States, 09/06/2003 .
A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass
Publikováno v:
Larsen, K P, Ravnkilde, J T, Ginnerup, M & Hansen, O 2002, Devices for fatigue testing of electroplated nickel (MEMS) . in The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, 2002. . IEEE, pp. 443-446, 15th IEEE International Conference on Micro Electro Mechanical Systems, Las Vegas, NV, United States, 20/01/2002 . https://doi.org/10.1109/MEMSYS.2002.984298
ResearcherID
Scopus-Elsevier
ResearcherID
Scopus-Elsevier
In-situ fatigue test devices with integrated electrostatic actuator were fabricated in electroplated nanocrystalline nickel (nano-nickel). The devices feature in-plane approximately pure bending with fixed displacement of the test specimen of the dim
Publikováno v:
Transducers ’01 Eurosensors XV ISBN: 9783540421504
In this paper two methods for fabrication of released nickel comb-drive devices are given. Both methods are shown to be compatible with a standard CMOS metallization technology, thus making it possible to fabricate low-cost monolithic integrated sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8941c08559ac5a5891514f60b059e072
https://doi.org/10.1007/978-3-642-59497-7_142
https://doi.org/10.1007/978-3-642-59497-7_142
Publikováno v:
Hansen, O, Ravnkilde, J T, Quaade, U, Stokbro, K & Grey, F 1998, ' Field-Induced Deformation as a Mechanism for Scanning Tunneling Microscopy Based Nanofabrication ', Physical Review Letters, vol. 81, no. 25, pp. 5572-5575 . https://doi.org/10.1103/PhysRevLett.81.5572
ResearcherID
Scopus-Elsevier
ResearcherID
Scopus-Elsevier
The voltage between tip and sample in a scanning tunneling microscope (STM) results in a large electric field localized near the tip apex. The mechanical stress due to this field can cause appreciable deformation of both tip and sample on the scale o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a82153369e5d4e1251b2f8454342705
https://orbit.dtu.dk/en/publications/e616f31f-aec6-4277-91c5-30caa60a8cbc
https://orbit.dtu.dk/en/publications/e616f31f-aec6-4277-91c5-30caa60a8cbc
Publikováno v:
Electronics Letters. 38:1526
A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, hig