Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Tuan-Yu Hung"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 15:437-442
In assessing the solder joint reliability using an accelerated thermal cycling (ATC) test methodology, which is widely used in the microelectronics industry, a common type of solder joint failure is the formation of fatigue cracks at the interface be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc4349bccd69cc040fa4fd4363b791da
https://doi.org/10.1109/tdmr.2015.2462726
https://doi.org/10.1109/tdmr.2015.2462726
Publikováno v:
Microelectronic Engineering. 120:114-120
As a three-terminal power semiconductor device, an insulated gate bipolar transistor (IGBT) chip is characterized by its fast switching and low switching loss, explaining its extensive use in high-power electrical products. However, Joule heating may
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8eb0a07d9f5e3144268a07d622054e1d
https://doi.org/10.1016/j.mee.2013.12.033
https://doi.org/10.1016/j.mee.2013.12.033
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 14:484-492
In this paper, a 3-D finite-element (FE) model was established based on real test samples. Coupled electrothermal and thermal-mechanical FE analyses were conducted to analyze the mechanical behavior of bonding wire under cyclic power loading. The cur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9daac1c4d3d4e7456530ff25bba46419
https://doi.org/10.1109/tdmr.2013.2288703
https://doi.org/10.1109/tdmr.2013.2288703
Publikováno v:
Microelectronic Engineering. 107:125-129
With the continuous expansion of high-power electronic product applications, the high resistance of power modules to cyclic current loading has become a major concern. The heat generated by a chip during operation causes the power module's temperatur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e550d16d4e46e5fcd783b973e58db5d
https://doi.org/10.1016/j.mee.2012.09.014
https://doi.org/10.1016/j.mee.2012.09.014
Publikováno v:
Microelectronics Reliability. 52:794-803
Light-emitting diodes (LEDs), which are generally used for indicator lights, have been continuously developed for the past 50 years. With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c50bb3470bc4a7ef2a991e95476e9758
https://doi.org/10.1016/j.microrel.2011.07.059
https://doi.org/10.1016/j.microrel.2011.07.059
Publikováno v:
Microelectronics Reliability. 51:1819-1823
Two analytical methods were proposed in this research, coupled electro-thermal finite element (FE) analysis and thermal–mechanical FE analysis, to analyze the mechanical behavior of bonding wire of power module under cyclic power loads, and the Int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::470112d4d8eb02422b5ffeed685eb4a9
https://doi.org/10.1016/j.microrel.2011.06.048
https://doi.org/10.1016/j.microrel.2011.06.048
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:681-689
Accompanying the increasing popularity of portable and handheld products, high reliability for board level drop test becomes a great concern for semiconductor and electronic product manufacturers. Meanwhile, for design purpose, a reliable impact life
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92a9ad95bca2cd22d5f864c52c6b771e
https://doi.org/10.1109/tadvp.2010.2042447
https://doi.org/10.1109/tadvp.2010.2042447
Publikováno v:
Microelectronics Reliability. 48:1149-1154
Accompanying the popularization of portable and handheld products, high reliability under board level drop test is a great concern to semiconductor manufacturers. In this study, a stress-buffer-enhanced package with fan-out capability is proposed to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bfd85bf47d0515cbdb01e2862fc453a
https://doi.org/10.1016/j.microrel.2008.06.024
https://doi.org/10.1016/j.microrel.2008.06.024
Autor:
Wood-Hi Cheng, Yi-Jen Chiu, Min-Ching Lin, Tien-Tsorng Shih, Chang-You Li, Tuan-Yu Hung, Pei-Hao Tseng
Publikováno v:
Journal of Lightwave Technology. 25:3488-3494
High-performance and low-cost 10-Gb/s bidirectional optical subassembly (BOSA) modules that are obtained by adopting low-cost transistor outline (TO)-Can materials and processes are proposed and demonstrated. The BOSA module consists of an uncooled 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb94f42cef8989b327ab0c56775a0507
https://doi.org/10.1109/jlt.2007.907786
https://doi.org/10.1109/jlt.2007.907786
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A high current load may cause the Joule heating, subsequently raising the chip temperature in a conventional power module. Temperature excursion in power chip may generate thermal stress, induce failure and reduce its reliability. Double-sided power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2f9db59abde0b473a8e07bf450faa41
https://doi.org/10.1109/eurosime.2015.7103093
https://doi.org/10.1109/eurosime.2015.7103093