Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Tsuyoshi Shioda"'
Autor:
Peter Hacke, Sergiu Spataru, Nancy H. Phillips, Tadanori Tanahashi, David C. Miller, Tsuyoshi Shioda, Michael D. Kempe, Michael Owen-Bellini, Kaushik Roy Choudhury, Keiichiro Sakurai, William J. Gambogi
Publikováno v:
Web of Science
Tanahahi, T, Sakurai, K, Shioda, T, Gambogi, W, Phillips, N, Choudhury, K, Spataru, S V, Miller, D, Kempe, M, Owen-Bellini, M & Hacke, P 2019, Reproducing the “Framing” by a Sequential Stress Test . in Proceedings of 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) ., 8980920, IEEE Press, I E E E Photovoltaic Specialists Conference. Conference Record, 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC), Chicago, United States, 16/06/2019 . https://doi.org/10.1109/PVSC40753.2019.8980920
Tanahahi, T, Sakurai, K, Shioda, T, Gambogi, W, Phillips, N, Choudhury, K, Spataru, S V, Miller, D, Kempe, M, Owen-Bellini, M & Hacke, P 2019, Reproducing the “Framing” by a Sequential Stress Test . in Proceedings of 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) ., 8980920, IEEE Press, I E E E Photovoltaic Specialists Conference. Conference Record, 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC), Chicago, United States, 16/06/2019 . https://doi.org/10.1109/PVSC40753.2019.8980920
The “Framing” (local discoloration along cell edges) was induced by a simple sequential accelerated stress test (consisting of hygrothermal- and UV-stressors) applied to the PV modules with high OTR (oxygen transmission rate) backsheet, irrespect
Autor:
Jinhua Wu, Kai Wang, Hui Juan Yan, Tsuyoshi Shioda, Richard Pitwon, Long Xiu Zhu, Alexander Carl Worrall, Marika Immonen, Hideo Itoh
Publikováno v:
Optics Communications. 362:22-32
The commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication, connector assembly and waveguide measurement. In this paper,
Autor:
P. Schneider, J. Wu, Tsuyoshi Shioda, Richard Pitwon, S. Dorresteiner, Lars Brusberg, Dionysios Manessis, Marika Immonen, H.J. Yan, K. Wang, Henning Schröder, H. Itoh
Although the prospects for commercial proliferation of optical circuit board (OPCB) technology at the turn of the century were crippled by the rapid slow-down in the telecoms sector following the stock market crash in 2001, embedded waveguide-based O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37b5b05f5e5de68073e00f816653a20f
https://doi.org/10.1016/b978-0-08-100512-5.00013-9
https://doi.org/10.1016/b978-0-08-100512-5.00013-9
Autor:
Tsuyoshi Shioda
Publikováno v:
NIPPON GOMU KYOKAISHI. 81:93-98
Recent trends for optical circuit using transparent polymer were described. There are two kinds of actual and potential markets for optical circuit. One is an optical component for optical telecommunication, the other is an optical circuit board for
Autor:
Tsuyoshi Shioda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 11:121-126
Autor:
Xinxin Chen, Michael D. Kempe, Tsuyoshi Shioda, Shigeo Suga, Nancy H. Phillips, David C. Miller, Amal Ballion, Sean Fowler, Jiangtao Feng, Shin Watanabe, Peter Hacke, John H. Wohlgemuth, Roger H. French, Laure-Emmanuelle Perret-Aebi, Christian C. Honeker, Fanny Sculati-Meillaud, Kurt P. Scott, Eleonora Annigoni, Lamont Elliott, Jayesh G. Bokria, Laura S. Bruckman, Michael Köhl, Hussam Khonkar, David M. Burns, Xiaohong Gu
Publikováno v:
2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC).
Reduced optical transmittance of encapsulants resulting from ultraviolet (UV) degradation has frequently been identified as a cause of decreased PV module performance through the life of service in the field. The present module safety and qualificati
Autor:
Tsuyoshi Shioda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 9:204-210
Autor:
Tsuyoshi Shioda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 9:86-90
Autor:
Tsuyoshi Shioda
Publikováno v:
KOBUNSHI RONBUNSHU. 61:1-11
Autor:
Tsuyoshi Shioda, Kenji Suzuki
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 7:607-612