Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Tsuyoshi Kamimura"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Hidetoshi Inoue, Tsuyoshi Kamimura, Hirokazu Noma, Yuto Shigeno, Hisato Takahashi, Daisuke Hashimoto, Satomi Kawamoto, Tomohiro Ookubo, Haruyuki Yoshii
Publikováno v:
International Symposium on Microelectronics. 2017:000025-000028
This paper reports on the study of flexible epoxy resin which lowers modulus to minimize warpage while maintaining high filler content. Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level. LCM requires hi
Autor:
Win Shwe Maw, Hideaki Araki, Satoru Yamada, Ryoichi Kimura, Hironori Katagiri, Kazuo Jimbo, Tsuyoshi Kamimura, Koichiro Oishi
Publikováno v:
Thin Solid Films. 515:5997-5999
The development of environment friendly type thin film solar cell Cu2ZnSnS4 (say CZTS-type) fabricated using abundant materials is introduced in this paper. Three RF sources co-sputtering continued with vapor phase sulfurization method (inline-type v
Autor:
Tadashi Ito, Satoru Yamada, Hironori Katagiri, Tatsuo Fukano, Kazuo Jimbo, Tsuyoshi Kamimura, Win Shwe Maw, Tomoyoshi Motohiro
Publikováno v:
Applied Physics Express. 1:041201
Cu2ZnSnS4 (CZTS) thin film solar cells have been fabricated by co-sputtering technique using three targets of Cu, SnS, and ZnS. CZTS-based thin film solar cells over 6.7% efficiency were obtained for the first time by soaking the CZTS layer on the Mo