Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Tsutomu Takeya"'
Publikováno v:
NTT Technical Review. 20:73-80
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50b95bd342ec18d6d009eb7f4c5e0047
https://doi.org/10.53829/ntr202211ra1
https://doi.org/10.53829/ntr202211ra1
Autor:
Munehiko Nagatani, Hitoshi Wakita, Teruo Jyo, Tsutomu Takeya, Hiroshi Yamazaki, Yoshihiro Ogiso, Miwa Mutoh, Yuta Shiratori, Minoru Ida, Fukutaro Hamaoka, Masanori Nakamura, Takayuki Kobayashi, Hiroyuki Takahashi, Yutaka Miyamoto
Publikováno v:
2022 IEEE Custom Integrated Circuits Conference (CICC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a240a229c893c4fb27e3c81236c0d47
https://doi.org/10.1109/cicc53496.2022.9772800
https://doi.org/10.1109/cicc53496.2022.9772800
Autor:
Masao Taguchi, Tsunaaki Shidei, Tsutomu Takeya, Tadahiro Kuroda, Atsutake Kosuge, Noriyuki Miura, Hiroki Ishikuro, Wataru Mizuhara
Publikováno v:
IEEE Journal of Solid-State Circuits. 49:223-231
A noncontact and housing-less thin-thick connecting method was developed for mobile industry processor interface (MIPI) applications. This paper describes the world's first 0.15-mm-thick connector using a vertical directional coupler (VDC) which enab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0597e9ab16a7a46c38cb8ddfebb6d477
https://doi.org/10.1109/jssc.2013.2282113
https://doi.org/10.1109/jssc.2013.2282113
Autor:
Tsutomu Takeya, Tadahiro Kuroda
Publikováno v:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences. :705-712
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80a6827d0b4027834e7979fc0d863311
https://doi.org/10.1587/transfun.e96.a.705
https://doi.org/10.1587/transfun.e96.a.705
Autor:
Noriyuki Miura, Masao Taguchi, Wataru Mizuhara, Tsutomu Takeya, Tsunaaki Shidei, Tadahiro Kuroda, Hiroki Ishikuro, Atsutake Kosuge
Publikováno v:
ISSCC
As silicon chip performance continues to increase, the interconnection capabilities should also be improved to achieve higher overall system performance. This paper proposes a new, small-size and high-speed non-contact interconnect between printed ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c34eb8833f17d444d9c7f890d741bf1
https://doi.org/10.1109/isscc.2013.6487699
https://doi.org/10.1109/isscc.2013.6487699
Publikováno v:
Extended Abstracts of the 2012 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfad6d865d0aa601eb989bb46a9245e1
https://doi.org/10.7567/ssdm.2012.j-6-2
https://doi.org/10.7567/ssdm.2012.j-6-2
Publikováno v:
ISSCC
The expanding capacity of today's memory cards and increasing speed of processors have created demands for high data rate interfaces between memory cards and processors. Compared to conventional contact pins, wireless interfaces have received tremend
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b42e12d0f86cd65ef529294ff2a9c46
https://doi.org/10.1109/isscc.2011.5746411
https://doi.org/10.1109/isscc.2011.5746411
Autor:
Hideyuki Sugita, Tadahiro Kuroda, Masayuki Mizuno, Tsutomu Takeya, Kazuhisa Sunaga, Koichi Yamaguchi, Yoichi Yoshida
Publikováno v:
CICC
We present a 6Gb/s wireline receiver having Frequency Division Multiplexing (FDM) with four frequency sub-channels. Its 6GS/s discrete-time filter consumes less power than a conventional filter which requires the same number of high-speed analog mixe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2619e431e24c3cf3e47888076478e4e0
https://doi.org/10.1109/cicc.2010.5617600
https://doi.org/10.1109/cicc.2010.5617600
Autor:
Tsutomu Takeya, Tadahiro Kuroda
Publikováno v:
2010 4th International Symposium on Communications, Control and Signal Processing (ISCCSP).
A timing recovery scheme for high-speed wireline multi tone communication systems called Analog Multi-Tone (AMT) has been proposed. An accurate timing recovery is essential to a reliable high-speed AMT system which demodulates in analog domain. Howev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::335b910148367d7008e2de616fd514df
https://doi.org/10.1109/isccsp.2010.5463481
https://doi.org/10.1109/isccsp.2010.5463481
Publikováno v:
2009 IEEE Asian Solid-State Circuits Conference.
Inductive-coupling link between stacked chips in a package communicates by using coils made by on-chip interconnections. An XY-coil layout style allows logic interconnections to go through the coil, which significantly saves interconnection resources
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d4f3b2b1c4ad65d53948485cbbdcded
https://doi.org/10.1109/asscc.2009.5357248
https://doi.org/10.1109/asscc.2009.5357248