Zobrazeno 1 - 10 of 23 pro vyhledávání: '"Tsutomu Kono"'
1
The numerical analysis of particle-size distribution of clusters in shear flow at one-dimensional closed system and three-dimensional open system
Autor: Shimada Ryotaro, Tsutomu Kono, Yoshiyuki Komoda, Koji Masuda
Publikováno v: Advanced Powder Technology. 30:774-785
Aimed at optimizing the resin-molding process, a method for numerically analyzing aggregation and dispersion behavior of the filler in resin composite was proposed. The flow of a resin composite during molding was calculated by using computational fl
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a658997825f384662f32b1b4c2f9ff3d
https://doi.org/10.1016/j.apt.2019.01.006
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5
Formulation of Mathematical Models for Estimating Residual Strain and Stress Components Correlated with 3-D Flow of Thermosetting Compounds
Autor: Tsutomu Kono, Junichi Saeki, Toshiya Teramae
Publikováno v: Seikei-Kakou. 16:309-316
A method for continuously analyzing three-dimensional flow, variation of strain components and Young's modulus after gelation during the molding process of thermosetting compounds has been developed. In this analysis, Kamal's model was used to calcul
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5a047ffb4224365355b48a0d352e7276
https://doi.org/10.4325/seikeikakou.16.309
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6
Analysis of Polyurethane Foaming Flow
Autor: Fukuda Katsumi, Tsutomu Kono, Kuninari Araki, Junichi Saeki, Takashi Iseki
Publikováno v: Seikei-Kakou. 14:526-530
Polyurethane foam has many excellent features such as thermal insulation and shock and sound absorption, and is used for refrigerator parts, car parts and many other products. Simulating the precise behavior of polyurethane foaming is very effective
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b075f2240eea83b0e5eca54f79381406
https://doi.org/10.4325/seikeikakou.14.526
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7
Study on prediction about residual position of void generated by resin flow
Autor: Hiroshi Takahashi, Tsutomu Kono, Mino Masayuki, Suzuki Naoya
Publikováno v: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Liquid epoxy resin is used in various types of mobile information equipment and devices and expected to be a key material for flip chip packaging [1-2]. The flip chip connection process is a thermo-compression molding process. In this process, air vo
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bba8bc9f37eb73be23ef96b022fac100
https://doi.org/10.1109/ectc.2014.6897583
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8
[Untitled]
Autor: Tsutomu Kono, Ying-Fu Wang, Makoto Iida, Hiroki Kuramoto, Shozo Nakamura
Publikováno v: Seikei-Kakou. 12:230-235
A combined molding technique of outsert molding of plastic to plastic structures is very effective in reducing production costs and improving recycling of electrical products. Outsert molding can reduce the process for assembling parts and unify the
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5fe6f3459dcd7717ca00b1462dc05064
https://doi.org/10.4325/seikeikakou.12.230
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