2N Au wire bonding for ultra fine picth BGA

Autor: Eu Poh Leng, Nick Vo, C.C. Yong, Zul-Kifli Mohd Faizal, Tsuriya Masahiro, Fadzli Sazilawati, Lee Boon Seong, Chin Teck Siong

Publikováno v: 2009 11th Electronics Packaging Technology Conference.

In this study, ultra fine pitch wire bonding on a BGA device with Al bond pad was performed to compare 2N wire with conventional 3N and 4N wires for reliability performance after thermal aging. Strip level thermal aging at 175 degree C was carried ou

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::50851b3e52b3569ad39c59cf16008123
https://doi.org/10.1109/eptc.2009.5416499

Comparison of advanced package warpage measurement metrologies.

Autor: Kultcrman, Ron W., Loh, Wei Keat, Fu, Haley, Tsuriya, Masahiro

Publikováno v: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-8, 8p

Technology Roadmap overviews and future direction through technology gaps.

Autor: Bader, Bill, Richardson, Chuck, Tsuriya, Masahiro

Publikováno v: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p219-224, 6p

iNEMI packaging technology roadmap highlights.

Autor: Bottoms, Bill, Tsuriya, Masahiro, Richardson, Chuck

Publikováno v: 2014 International Conference on Electronics Packaging (ICEP); 2014, p188-192, 5p

The reliability performance of copper wire bonding BGA package by way of HAST methodology.

Autor: Tsuriya, Masahiro, Lee, Dem, Lee, Jeffrey Chang Bing, Kim, JoonSu, Deai, Hiroyuki, Yeung, Johnny

Publikováno v: 2013 8th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2013, p180-185, 6p