Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tsung-Yi Kuo"'
Autor:
Tsung-Yi Kuo, 郭宗義
106
In recent years, the electronic components have been oriented towards light and thin development with the advancement of science and technology, When the components are thin to a nanoscale, they get with flexibility, which has become one of
In recent years, the electronic components have been oriented towards light and thin development with the advancement of science and technology, When the components are thin to a nanoscale, they get with flexibility, which has become one of
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/q64533
Autor:
Tsung-Yi Kuo, 郭宗益
104
The next generation wafer-level packaging technology suffers from serious signal and power integrity issues due to lower re-distribution layer (RDL). Because of serious parasitic effects caused by the high-density lower RDL traces, the robus
The next generation wafer-level packaging technology suffers from serious signal and power integrity issues due to lower re-distribution layer (RDL). Because of serious parasitic effects caused by the high-density lower RDL traces, the robus
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/16601295981385016256
Autor:
Ying-Ting Chung, Tsung-Yi Kuo, Kuan-Neng Chen, Tzu-Chieh Chou, Yu-Wei Liu, Demin Liu, Zhong-Jie Hong, Han-Wen Hu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:573-578
Pt has been investigated as a metal passivation material to achieve low-temperature Cu–Cu direct bonding process. With 10-nm Pt passivation layer capping on Cu surface, a good bonding surface with no oxides and small grain size can be obtained. Dur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6c8a639d7390dc3769e986711f56e0d
https://doi.org/10.1109/tcpmt.2021.3069085
https://doi.org/10.1109/tcpmt.2021.3069085
Autor:
Tsung-Yi Kuo, Ming-Tzong Yang, Kai-Bin Wu, I-Hsuan Peng, Ruey-Beei Wu, Cheng-Chou Hung, Benson Lin
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1431-1439
The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic effects by the high-density RDL traces and less flex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83701740a3cb1642e639b7bfe8163d15
https://doi.org/10.1109/tcpmt.2018.2850528
https://doi.org/10.1109/tcpmt.2018.2850528
Autor:
Tsung-Yi Kuo, Emil Gutman
Publikováno v:
JAMA: The Journal of the American Medical Association. 230:1051
History: A 26-year-old man, a non-smoker, was admitted to the Veterans Administration Hospital, Dayton, Ohio, in May 1943 with complaints of nonproductive cough for 14 months, 13-kg (28-lb) weight loss over a nine-month period, pain in the left lower
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03d88fa40ebe3cb093d4956e2ba3803e
https://doi.org/10.1001/jama.1974.03240070081044
https://doi.org/10.1001/jama.1974.03240070081044