Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Tsung-Fu Yao"'
Autor:
Tsung-Fu Yao, 姚宗甫
99
Through the multi advantages of light weight, low cost, and easy-to-manufacture, plastic material has become a widely-used engineering material. Plastic material has been used for micro-fluidic devices. In the manufacture of micro-fluidic dev
Through the multi advantages of light weight, low cost, and easy-to-manufacture, plastic material has become a widely-used engineering material. Plastic material has been used for micro-fluidic devices. In the manufacture of micro-fluidic dev
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/82995456191828516313
Publikováno v:
Precision Engineering. 57:137-148
This paper presents the development of a metrology framework and proof-of-concept tool to perform direct, nanometer-scale topography measurements for real-time process control in the roll-to-roll manufacturing of nanopatterened materials, films, and
Publikováno v:
Precision Engineering. 47:147-157
Quality control and defect monitoring are of great importance to the semiconductor industry. This article presents a system to enable inspection of nanoscale features in-line with nanomanufacturing processes. The ultimate goal of this research is to
Publikováno v:
Journal of Micro and Nano-Manufacturing. 5
One of the major challenges in nanoscale manufacturing is defect control because it is difficult to measure nanoscale features in-line with the manufacturing process. Optical inspection typically is not an option at the nanoscale level due to the dif
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 18:1
Effective measurement of fabricated structures is critical to the cost-effective production of modern electronics. However, traditional tip-based approaches are poorly suited to in-line inspection at current manufacturing speeds. We present the devel
Autor:
Marianna Gonzales, Tsung Fu Yao, Nathan Riojas, Duenner Andrew C, Michael Cullinan, Bruno De Hoyos
Publikováno v:
Journal of Micro and Nano-Manufacturing. 4
This paper introduces a low-cost, automated wafer alignment system capable of submicron wafer positioning repeatability. Accurate wafer alignment is critical in a number of nanomanufacturing and nanometrology applications where it is necessary to be
Publikováno v:
Volume 1: Processing.
One of the major challenges in nanoscale manufacturing is defect control because it is difficult to measure nanoscale features in-line with the manufacturing process. Optical inspection typically is not an option at the nanoscale level due to the dif
Publikováno v:
Microelectronic Engineering. 88:2908-2912
Periodic nanostructures have played critical roles in key components for optical applications. Femtosecond laser-induced periodic surface structures (FLIPSS) in nano scale on many material surfaces have drawn much attention in recent years. However,
Autor:
Tsung Fu Yao, Sen-Yeu Yang
Publikováno v:
Microsystem Technologies. 19(2):151-157
Microchip components may involve different polymeric materials for integrated functions, and the thermal bonding of heterogeneous materials is a challenge. This study is devoted to the bonding of polycarbonate (PC) and polymethacrylate (PMMA) materia