Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Tsung-Fu Yang"'
Autor:
Chih-Hung Chung, Chiung-Yuan Lin, Tsung-Fu Yang, Hsin-Hui Huang, Tuo-Hung Hou, Blanka Magyari-Köpe
Publikováno v:
AIP Advances, Vol 12, Iss 12, Pp 125212-125212-4 (2022)
For a resistance random access memory whose insulating matrix is based on transition metal oxides, the underlying microscopic mechanism of its conductive filaments is crucial yet challenging to understand. In this paper, our first-principles calculat
Externí odkaz:
https://doaj.org/article/121191eaa28141c8865e72e710d965a5
Autor:
Tsung-Fu Yang, 楊聰福
97
For more than ten years, the international community has been seriously looking into the issue of illegal immigration, especially the social, political, economic, health, and human rights protection problems brought about by smuggling and hum
For more than ten years, the international community has been seriously looking into the issue of illegal immigration, especially the social, political, economic, health, and human rights protection problems brought about by smuggling and hum
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/14642846511774260160
Publikováno v:
International Journal of Social Sciences and Artistic Innovations. 1:26-34
This paper reviews the possible problems when realizing a virtual choir system. Under the common computer specifications, sound cards contribute its delay significantly. Applying Audio Stream Input Output (ASIO) reduces the delay to 6 ms in the propo
Publikováno v:
Microelectronic Engineering. 107:107-113
With the impressive size shrinkage of advanced transistors and Cu/low-k interconnect systems, the introduction of through-silicon via integrated with three-dimensional (3D) chip-stacking approaches has become one of the major packaging technologies t
Autor:
Chih-Sheng Wu, Tai-Hung Chen, Kuo-Shu Kao, Tsung-Fu Yang, John H. Lau, Chau-Jie Zhan, Chang-Chun Lee, C. W. Fang
Publikováno v:
Microelectronic Engineering. 107:101-106
Multi-scale modeling construction and subsequent stress analysis for the mechanical reliability estimation of three-dimensional (3D) integrated circuit (IC) packages is challenging. This paper presents a simulation-based methodology to calculate the
Publikováno v:
Soldering & Surface Mount Technology. 24:287-293
Purpose3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch microbump connections, capillary dispensing presents big limitati
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1412-1419
3-D integration provides a promising approach for the construction of complex microsystems through the bonding and interconnection of individually optimized device layers without sacrificing system performance. The use of traditional underfill proces
Publikováno v:
Biomedical Engineering: Applications, Basis and Communications. 23:501-508
Planar electrode array is an important tool to evaluate perceptual or cognitive functions of the cortex and prosthetic applications. Many construction methods have been developed. To maximize the usefulness of an array electrode, a low-cost, precise,
Autor:
Tsung-Fu Yang, Chun-Chih Chuang, Jin-Ye Juang, Tao-Chih Chang, Yin-Po Hung, Ching-Tsung Lin, Yu-Min Lin, Pei-Chen Chang, Chau-Jie Zhan
Publikováno v:
Microelectronics Reliability. 48:1875-1881
A flip chip package was assembled by using 6-layer laminated polyimide coreless substrate, eutectic Sn37Pb solder bump, two kinds of underfill materials and Sn3.0Ag0.5Cu solder balls. Regarding to the yield, the peripheral solder joints were often fo