Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Tsung Chieh Chiu"'
Publikováno v:
ECS Journal of Solid State Science and Technology. 7:P109-P113
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7740be69eeafeea04e286bfba23eeb7
https://doi.org/10.1149/2.0121803jss
https://doi.org/10.1149/2.0121803jss
Autor:
Kwang-Lung Lin, Tsung Chieh Chiu
Publikováno v:
Journal of Alloys and Compounds. 712:111-120
The phase evolution as well as microstructural change of thin film Au/Sn reaction couple was investigated at room temperature with respect to 1.0 × 10 4 A/cm 2 of current stressing. Transmission electron microscopy (TEM) equipped with nano beam elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::372eba93edfa69bef75e787a95b33062
https://doi.org/10.1016/j.jallcom.2017.04.074
https://doi.org/10.1016/j.jallcom.2017.04.074
Publikováno v:
Intermetallics. 85:117-124
Electromigration will induce polarity effects on the formation and dissolution of intermetallic compounds (IMCs) at the electrodes in conventional solder joints. However, the entire solder joint of a microbump may convert to intermetallic compounds a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::880849ef82cb862383a7fcb2ed8147f3
https://doi.org/10.1016/j.intermet.2017.02.012
https://doi.org/10.1016/j.intermet.2017.02.012
Publikováno v:
Materials Letters. 160:309-313
This study investigated the electro-dissolution, supersaturation and recrystallization of the second phase Bi in the Sn5Bi solder under 4.0×10 3 –6.0×10 3 A/cm 2 current stressing at 25 °C. The ex-situ XRD analysis of the current stressed specim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e771d95f78a4b9e5153633331bf2e2
https://doi.org/10.1016/j.matlet.2015.07.131
https://doi.org/10.1016/j.matlet.2015.07.131
Autor:
Wei Yu Chen, Tsung Chieh Chiu, Hsin Yi Lee, Kwang-Lung Lin, Wei Luen Jang, Chung Li Dong, Albert T. Wu
Publikováno v:
Scripta Materialia. 68:317-320
The microstructural evolution of the intermetallic compound (Cu 6 Sn 5 ) in Sn–xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36cfdedc2497539ce0f09a2296ff82ae
https://doi.org/10.1016/j.scriptamat.2012.11.001
https://doi.org/10.1016/j.scriptamat.2012.11.001
Publikováno v:
Intermetallics. 26:40-43
The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu 6 Sn 5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu 6 Sn 5 dissolves in Sn0.7Cu at 1.0 × 10 4 A/cm 2 of current stressing under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::185253e7bf9f40fe00c0b6d79adf01a2
https://doi.org/10.1016/j.intermet.2012.02.022
https://doi.org/10.1016/j.intermet.2012.02.022
Autor:
Kwang-Lung Lin, Tsung Chieh Chiu
Publikováno v:
Intermetallics. 23:208-216
In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100 °C, 2.6 × 103 A/cm2 of current stressing. With electron flow from the Cu toward
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91a381035cd6fc4f7b7b8eedb27f6396
https://doi.org/10.1016/j.intermet.2011.12.010
https://doi.org/10.1016/j.intermet.2011.12.010
Publikováno v:
International Journal of Hydrogen Energy. 37:3491-3499
An efficient and cost-effective method has been developed to produce high quality buckypapers from multi-walled carbon nanotubes. The buckypapers were then used as a substrate for AB5 hydrogen storage alloy electrodes, and electrochemical performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9c6023c8ea6f51a6cee4bf3d0d47eaf
https://doi.org/10.1016/j.ijhydene.2011.10.110
https://doi.org/10.1016/j.ijhydene.2011.10.110
Publikováno v:
Journal of Applied Physics. 123:115102
An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IM
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b8e8a3c6a23f13a9f20ccd5b86161ef
https://doi.org/10.1063/1.5011667
https://doi.org/10.1063/1.5011667
Autor:
Kwang-Lung Lin, Tsung Chieh Chiu
Publikováno v:
Intermetallics. 17:1105-1114
An investigation of microstructural evolution with various current densities in a lead-free Cu/SnAgCu/Au/Cu solder system was conducted in this study. Current stressing induced migration of Cu toward the anode and resulted in the formation of Cu 6 Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18bca6398928c82f9f32a87837faa6d0
https://doi.org/10.1016/j.intermet.2009.05.014
https://doi.org/10.1016/j.intermet.2009.05.014