Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Tsuneo Kurita"'
Publikováno v:
CIRP Journal of Manufacturing Science and Technology. 38:509-517
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74b10f563709b4979882c4e8004d83c5
https://doi.org/10.1016/j.cirpj.2022.05.019
https://doi.org/10.1016/j.cirpj.2022.05.019
Publikováno v:
Journal of Manufacturing Processes. 60:636-643
Electrochemical machining (ECM) is applied to a wide variety of metal processing. While ECM has many machining characteristics, bubbles and electrolytic product disturb current flow and decrease the machining efficiency. To apply ECM to micro-shape m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4010d3bbf237f8cf65951baca51dfae
https://doi.org/10.1016/j.jmapro.2020.10.045
https://doi.org/10.1016/j.jmapro.2020.10.045
Publikováno v:
Journal of Materials Processing Technology. 242:228-234
One of the difficulties in laser processing is removal of the heat-affected zone (HAZ), such as resolidified material on the surface of the work material. If a processing technology can be developed to minimize the generation of HAZ, the function los
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6955e606f8649c927ab253964afb58a
https://doi.org/10.1016/j.jmatprotec.2016.11.039
https://doi.org/10.1016/j.jmatprotec.2016.11.039
Publikováno v:
International Journal of Automation Technology. 10:786-793
Single-crystal, silicon carbide (SiC) wafers surpass silicon in terms of voltage resistance and heat resistance, and show promise for use in power semiconductor device applications. The aim of this research is to develop a complex machining technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13165c75dbdaff8677832c19b6b3c56d
https://doi.org/10.20965/ijat.2016.p0786
https://doi.org/10.20965/ijat.2016.p0786
Publikováno v:
Journal of Micro and Nano-Manufacturing. 5
The aim of this research is to develop a combined polishing technology for single-crystal silicon carbide (SiC) wafers, which is known to be difficult to process due to its high hardness. This paper proposes a combined polishing method based on conve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::16ec19c71db3e765d51dbd6bec1262b9
https://doi.org/10.1115/1.4036828
https://doi.org/10.1115/1.4036828
Autor:
Tsuneo Kurita, Nagayoshi Kasashima
Publikováno v:
Optics and Lasers in Engineering. 50:354-358
In the micro-fabrication, small installation misalignment and deformation of the workpiece cause fatal damage. On-machine measurement is one of the efficient methods to prevent this damage. Our system performs the laser machining and the three-dimens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::119e91c9b24a4cac5c44aba3dc868acd
https://doi.org/10.1016/j.optlaseng.2011.10.022
https://doi.org/10.1016/j.optlaseng.2011.10.022
Autor:
Kiwamu Ashida, Hiroki Yamakiri, Kobayashi Nobutoshi, Shinya Sasaki, Nagayoshi Kasashima, Nobuhito Ichihashi, Tsuneo Kurita
Publikováno v:
Optics and Lasers in Engineering. 49:1216-1223
An IC is generally decapsulated with wet etching technology. The influences of environment and worker's health in usage and waste of the chemicals are seen as problems. Improvement of processing time is also needed. In order to overcome them, the las
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c68ca2c3c4434d735efca800596cac96
https://doi.org/10.1016/j.optlaseng.2011.04.013
https://doi.org/10.1016/j.optlaseng.2011.04.013
Publikováno v:
Tribology International. 44:579-584
Water lubrication is one of the candidates of the tribo-system with low negative environmental impact. It is well known that some kinds of ceramics show excellent tribological properties under lubrication with water. The characteristic improvement wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5db80730c14b3c77d86096ea0774f2a5
https://doi.org/10.1016/j.triboint.2010.11.002
https://doi.org/10.1016/j.triboint.2010.11.002
Autor:
Shinya Sasaki, Shinsuke Kondoh, Nozomu Mishima, Tsuneo Kurita, Hiroki Yamakiri, Ryuichi Saitoh
Publikováno v:
Journal of Mechanical Science and Technology. 24:275-278
Recent engineering products must meet the demand for downsizing and sophistication. Environmentally benign manufacturing has also become a key technology for sustainable development. Striking a balance between product quality and environmental impact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43cd7be6706a3e3ff00c022e3921d5b3
https://doi.org/10.1007/s12206-009-1170-1
https://doi.org/10.1007/s12206-009-1170-1
Publikováno v:
International Journal of Automation Technology. 3:56-62
To evaluate the environmental impact of products, we propose a total performance indicator (TPI), an efficiency index that simultaneously takes into account cost, environmental impact, and value. We propose applying the TPI to evaluating manufacturin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d62ecb7304b262b43d569f5bc1475fbd
https://doi.org/10.20965/ijat.2009.p0056
https://doi.org/10.20965/ijat.2009.p0056