Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Tse-Lin Lai"'
Autor:
Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu
Publikováno v:
Royal Society Open Science, Vol 11, Iss 9 (2024)
Fine-grain copper (Cu) films (grain size: 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu–Cu direct bonding can be achieved with present-day fine-grain Cu films at 130℃ in air
Externí odkaz:
https://doaj.org/article/d8a16e4e273341e99b79d76575454a59
Publikováno v:
Materials Chemistry and Physics. 294:126880
Autor:
Pai Jung Chang, Chien Hung Chiang, Tse Lin Lai, Chun Kai Huang, Wei Han Lai, Cheng Cheng, Cheng Yi Liu, Jin Long Wu, Chun Guey Wu, Chung Yu Chiu
Publikováno v:
Energy Technology. 9:2001129
Publikováno v:
Anti-counterfeiting, Security, and Identification.
Pending the possible realization of quantum computers, the RSA algorithm face critical challenges because of weaknesses under quantum cryptanalysis. A possible replacement may be knapsack cryptosystems, which do not yield any weaknesses to quantum co
Publikováno v:
AINA
With the possible advent of quantum computers, the most famous public key cryptosystem for network applications - RSA, is facing critical challenges in the near future. A replacement might be knapsack cryptosystems, which do not yield any benefits to