Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tsan-Cheng Chuang"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. In order to prove the novel methodology, the specimens with 90nm process and soft failures were chosen for the experim
Publikováno v:
International Symposium for Testing and Failure Analysis.
Shallow junction formation in silicon chips is a hot topic in the semiconductor industry. Reduction of power consumption of integrated circuits and an increase of the device performance would drastically reduce the sizes of circuits and, therefore, w
Publikováno v:
13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
This paper described how to use conductive atomic force microscope (C-AFM) and scanning capacitance microscope (SCM) alternately to catch very tiny and cunning defect modes hidden in the indiscernible corner. These schemes are easily implemented with