Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Trevor M. Braun"'
Autor:
Trevor M. Braun, Daniel T. Schwartz
Publikováno v:
Frontiers in Chemistry, Vol 7 (2019)
Bipolar electrochemistry involves spatial separation of charge balanced reduction and oxidation reactions on an electrically floating electrode, a result of intricate coupling of the work piece with the ohmic drop in the electrochemical cell and to t
Externí odkaz:
https://doaj.org/article/9b5a29b449044663965a4a45b1a1c53a
Publikováno v:
Accounts of Chemical Research. 56:1004-1017
Publikováno v:
Langmuir. 39:4924-4935
Autor:
Howie Joress, Brian DeCost, Najlaa Hassan, Trevor M. Braun, Justin M. Gorham, Jason Hattrick-Simpers
Publikováno v:
Electrochimica Acta. 428:140866
We describe the development of a millifluidic based scanning droplet cell platform for rapid and automated corrosion. This system allows for measurement of corrosion properties (e.g., open circuit potential, corrosion current through Tafel and linear
Autor:
Logan Ward, Ryan P. Smith, Suchismita Sarker, Jason R. Hattrick-Simpers, Kevin J. Laws, Howie Joress, Apurva Mehta, Brian L. DeCost, Trevor M. Braun, Sidra Jilani
Publikováno v:
ACS Comb Sci
On the basis of a set of machine learning predictions of glass formation in the Ni–Ti–Al system, we have undertaken a high-throughput experimental study of that system. We utilized rapid synthesis followed by high-throughput structural and electr
Publikováno v:
Journal of The Electrochemical Society. 165:D291-D300
This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine suppressor. Feature filling occurs due to the interaction of transport limited suppressor a
Publikováno v:
J Electrochem Soc
The microstructure of copper filled through silicon vias deposited in a CuSO(4) + H(2)SO(4) electrolyte containing micromolar concentrations of deposition rate suppressing poloxamine and chloride additives is explored using electron backscatter diffr
Publikováno v:
ECS Meeting Abstracts. :923-923
Historically speaking, and to the present day, the commercial success of thin films has much to do with the ability of surfactants to yield smooth bright surfaces. The microelectronics industry has provided significant motivation for the development
Publikováno v:
ECS Meeting Abstracts. :1946-1946
Copper electrodeposition from an electrolyte containing a polyether suppressor and chloride exhibits bistable behavior characteristic of s-shaped negative differential (S-NDR) critical systems. The polyether and chloride form a co-adsorbed adlayer on
Publikováno v:
Electrochimica Acta. 375:137925
Void-free Cu electrodeposition in high aspect ratio features requires, at a minimum, an additive package containing micromolar halide and polyether that combine to form a co-adsorbed adlayer that inhibits metal deposition on the electrode interface.