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pro vyhledávání: '"Trevor Knutson"'
Autor:
Robert Rhoades, Dorota Temple, Trevor Knutson, Christopher Gregory, Yun Zhang, Dean Malta, Thomas Richardson, Chen Wang
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
The fabrication of through-silicon vias (TSVs) is a major component in the development of three-dimensional (3D) integration technology and advanced 3D packaging approaches. The large diameter and length of TSVs, as compared to traditional interconne