Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Travis F. Dale"'
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2012887ba2cbbd03464dd80d2889a5b
https://doi.org/10.1007/s11664-021-09256-1
https://doi.org/10.1007/s11664-021-09256-1
Autor:
Bernard Glasauer, Ian Bernander, Travis F. Dale, Yuvraj Singh, Peng Su, Carol A. Handwerker, Ganesh Subbarayan
Publikováno v:
Journal of Electronic Packaging. 142
Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60972c33dddc6a81c8df76f1911c57ec
https://doi.org/10.1115/1.4048109
https://doi.org/10.1115/1.4048109
Autor:
Ian Bernander, Ganesh Subbarayan, Travis F. Dale, Peng Su, Carol A. Handwerker, Yuvraj Singh, Bernard Glasauer
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39c661b15d7d3dd163f036bff4aa73f1
https://doi.org/10.1115/ipack2019-6507
https://doi.org/10.1115/ipack2019-6507