Zobrazeno 1 - 10
of 734
pro vyhledávání: '"Transient liquid phase bonding"'
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 25-39 (2024)
FGH98 nickel-based powder metallurgy superalloy was successfully bonded via transient liquid phase (TLP) bonding technique with a BNi-2 interlayer. The typical joint consisted of three characteristic zones including: ASZ composed of multiple silicon
Externí odkaz:
https://doaj.org/article/35f92447212446e0a2077632abf77cc9
Autor:
Hikaru KAWASE, Fei Shen ONG, Sota OSHIMA, Hirobumi TOBE, Tetsuya MATSUNAGA, Koichi KITAZONO, Eiichi SATO
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 90, Iss 937, Pp 24-00060-24-00060 (2024)
In dissimilar joints between Si3N4 and Ti-6Al-4V, insertion of a ductile Nb interlayer is effective for stress relaxation under bonding and loading. In this study, elastoplastic analysis using the finite element method (FEM) was applied to determine
Externí odkaz:
https://doaj.org/article/280c293b480442a7be786d38a7fd69ec
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 2856-2867 (2023)
This study presents a new structure for transient liquid phase (TLP) bonding using Cu foam and Cu–Sn paste. Cu foam and Cu–Sn paste with large reaction surface areas were used to reduce the long bonding time, which is a disadvantage of the conven
Externí odkaz:
https://doaj.org/article/c66ab93f0a85462a88ff0ca4d192704b
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 8, Iss 4, p 143 (2024)
This study investigated the impact of temperature, time, and homogenisation on the transient liquid phase bonding of Inconel 617 to stainless steel 310, employing AWS BNI2 foil as an interlayer. Nine test series were conducted at temperatures of 1050
Externí odkaz:
https://doaj.org/article/ae175078111d462994cffdd2af035d73
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 3643-3656 (2023)
The Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.6B4C/Cu joints were prepared by transient liquid phase (TLP) bonding technology to verify the reliability of low-temperature connection joints. Intermetallic compound (IMC) evolution at the interface under different i
Externí odkaz:
https://doaj.org/article/ee04975da7114946ba4e10f027a38b86
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 67, Iss No 4, Pp 1283-1291 (2022)
Ultrasound-promoted transient liquid phase bonding (U-TLP) is a high quality, high efficiency, and low-cost method for fast bonding of difficult-wetting materials in the atmospheric environment. In this paper, U-TLP was used to bond SiC particles rei
Externí odkaz:
https://doaj.org/article/514999131d724527b8ae33529750d445
Autor:
Ali Izadi Ghahferokhi, Masoud Kasiri-Asgarani, Reza Ebrahimi-kahrizsangi, Mahdi Rafiei, Hamid Reza Bakhsheshi-Rad, Kamran Amini, Filippo Berto
Publikováno v:
Journal of Materials Research and Technology, Vol 21, Iss , Pp 2178-2190 (2022)
The effect of bonding temperature and bonding time on the microstructure of transient liquid phase (TLP) bonding named GTD111 and IN718 superalloys, using a commercial Ni–B–Cr filler alloy (BNi-2) interlayer were evaluated. The sandwich assembly
Externí odkaz:
https://doaj.org/article/23bda903c3b64c7b9346ddef592208ee
Publikováno v:
Journal of Materials Research and Technology, Vol 20, Iss , Pp 4052-4065 (2022)
This paper investigates the idea of using Cu/CNT composite interlayer in the transient liquid phase (TLP) bonding of Ti–6Al–4V/AISI 304 stainless steel. In this investigation, initially TLP was carried out using a pure copper interlayer at 900, 9
Externí odkaz:
https://doaj.org/article/a23e47e198224f3483f2c9399e455890
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Akademický článek
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