Zobrazeno 1 - 10
of 871
pro vyhledávání: '"Transient Liquid Phase Bonding"'
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 25-39 (2024)
FGH98 nickel-based powder metallurgy superalloy was successfully bonded via transient liquid phase (TLP) bonding technique with a BNi-2 interlayer. The typical joint consisted of three characteristic zones including: ASZ composed of multiple silicon
Externí odkaz:
https://doaj.org/article/35f92447212446e0a2077632abf77cc9
Autor:
Hikaru KAWASE, Fei Shen ONG, Sota OSHIMA, Hirobumi TOBE, Tetsuya MATSUNAGA, Koichi KITAZONO, Eiichi SATO
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 90, Iss 937, Pp 24-00060-24-00060 (2024)
In dissimilar joints between Si3N4 and Ti-6Al-4V, insertion of a ductile Nb interlayer is effective for stress relaxation under bonding and loading. In this study, elastoplastic analysis using the finite element method (FEM) was applied to determine
Externí odkaz:
https://doaj.org/article/280c293b480442a7be786d38a7fd69ec
Publikováno v:
In Vacuum November 2024 229
Autor:
Li, Yinghao a, b, Wang, Chunxia a, b, c, ⁎, Liang, Shujun a, b, Li, Yunxiang a, b, Li, Chao a, b
Publikováno v:
In Materials Today Communications August 2024 40
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 2856-2867 (2023)
This study presents a new structure for transient liquid phase (TLP) bonding using Cu foam and Cu–Sn paste. Cu foam and Cu–Sn paste with large reaction surface areas were used to reduce the long bonding time, which is a disadvantage of the conven
Externí odkaz:
https://doaj.org/article/c66ab93f0a85462a88ff0ca4d192704b
Autor:
Guo, Wei a, b, ⁎⁎, 1, Xin, Jingru a, b, 1, Hao, Ding a, b, Xiong, Jiangtao a, b, ⁎, Li, Jinglong a, b, ⁎⁎⁎
Publikováno v:
In Journal of Materials Research and Technology May-June 2024 30:25-39
Autor:
Svetlizky, David a, Zheng, Baolong b, Wang, Xin b, Jiang, Sen b, Valdevit, Lorenzo b, Schoenung, Julie M. b, c, Lavernia, Enrique J. b, c, Eliaz, Noam a, ⁎
Publikováno v:
In Applied Materials Today April 2024 37
Publikováno v:
In Materials Today Communications March 2024 38
Publikováno v:
In Materials Science & Engineering A March 2024 895
Autor:
Liu, Xunda a, b, ⁎, Huo, Fupeng c, Wang, Jianhao a, Tatsumi, Hiroaki a, Jin, Zhi a, Chen, Zhong d, Nishikawa, Hiroshi a, ⁎
Publikováno v:
In Surfaces and Interfaces February 2024 45