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pro vyhledávání: '"Tran Duc Chinh"'
Autor:
Tran Duc Chinh
Publikováno v:
Опір матеріалів і теорія споруд, Iss 96, Pp 66-73 (2015)
Based on the integral representation of the displacements functions through Green's functions, the author proposed a method to solve the system of differential equations of the given problem. The equations were solved approximately by reducing to alg
Autor:
Dang Xuan Truong, Tran Duc Chinh
Publikováno v:
Опір матеріалів і теорія споруд, Iss 93, Pp 73-83 (2014)
The report presents a methodology to determine the directions of the stiffness principal axis (in this case subject to the linear displacement and forced rotation angle) of a solid object interact with the surrounding environment by resilient bearing
Autor:
Tran Duc Chinh
Publikováno v:
International Journal of Mechanical Sciences. 42:1971-1982
In this paper the author, has presented a solution to the problem of dynamics of shallow shell taking into account physical non-linearities. The shell is made of non-linear material obeying a cubic stress–strain law, and energy dissipation has been
Publikováno v:
Journal of Applied Physics. 90:2612-2614
During a comparative study of second-harmonic generation (SHG) and sum-frequency generation (SFG) in single-crystal and polycrystalline ZnSe, the polycrystalline material showed a dot pattern in the SHG as well as in the SFG output. No such pattern w
Autor:
Vladimir Dr. Korobochko, Bjoern Mader, Kai Gaebel, Juergen Kleinschmidt, Henry Birner, Guido Hergenhan, Jesko Dr. Brudermann, Sven Goetze, Denis Bolshukhin, Uwe Stamm, Imtiaz Ahmad, Diethard Kloepfel, Guido Schriever, Frank Flohrer, Rainer Mueller, Tran Duc Chinh, Christian Ziener, Jens Ringling
Publikováno v:
High-Power Laser Ablation V.
The availability of extreme ultraviolet (EUV) light sources, measurement tools and integrated test systems is of major importance for the development of EUV lithography for use in high volume chip manufacturing which is expected to start in 2009. The
Autor:
Juergen Kleinschmidt, Tran Duc Chinh, Guido Hergenhan, Guido Schriever, Vladimir Korobotchko, Sven Goetze, Henry Birner, Imtiaz Ahmad, Rainer Mueller, Jens Ringling, Christian Ziener, Frank Flohrer, Uwe Stamm, Diethard Kloepfel, Björn Mader, Kai Gaebel, Denis Bolshukhin, Jesko Dr. Brudermann
Publikováno v:
SPIE Proceedings.
Semiconductor chip manufacturers are expecting to use extreme ultraviolet (EUV) lithography for high volume manufacturing of DRAMs and ICs starting by the end of this decade. Among all the technologies and modules which have to be developed EUV sourc
Autor:
TRAN DUC, CHINH
Publikováno v:
International Journal for Numerical Methods in Engineering; 1997, Vol. 40 Issue 10, p1749-1765, 17p