Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Toshitake Seki"'
Autor:
Koushik Ramachandran, Toshitake Seki, Kaya Demir, Venky Sundaram, Gokul Kumar, Yuya Suzuki, Vijay Sukumaran, Rao Tummala, Yoichiro Sato
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:786-795
A double-sided and ultrathin 3-D glass interposer with through package vias (TPVs) at same pitch as through silicon vias (TSVs) in silicon interposers is developed to provide a compelling alternative to 3-D IC stacking of logic and memory devices wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06dd94af5b19e49af37fe2f2a6b08711
https://doi.org/10.1109/tcpmt.2014.2303427
https://doi.org/10.1109/tcpmt.2014.2303427
Autor:
Yutaka Takagi, Toshitake Seki, Yoichiro Sato, Vanessa Smet, Rao Tummala, Venky Sundaram, Makoto Kobayashi
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
This paper presents the first demonstration of an ultra-thin glass BGA package that is assembled on to mother board with standard SMT technology. Such a package has many new advances that include ultra-thin glass, high speed through via hole formatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21624611dc6f97895e30feb5c3fa0969
https://doi.org/10.1109/ectc.2014.6897313
https://doi.org/10.1109/ectc.2014.6897313
Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars.
Autor:
Menezes, Gary, Smet, Vanessa, Kobayashi, Makoto, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1959-1964, 6p
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1-38, 38p
Autor:
Sato, Yoichiro, Sitaraman, Srikrishna, Sukumaran, Vijay, Chou, Bruce, Min, Junki, Ono, Motoshi, Karoui, Choukri, Dosseul, Franck, Nopper, Christian, Swaminathan, Madhavan, Sundaram, Venky, Tummala, Rao
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1656-1661, 6p
Autor:
Sukumaran, Vijay, Kumar, Gokul, Ramachandran, Koushik, Suzuki, Yuya, Demir, Kaya, Sato, Yoichiro, Seki, Toshitake, Sundaram, Venky, Tummala, R. R.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; May2014, Vol. 4 Issue 5, p786-795, 10p
Publikováno v:
Journal of Materials Science: Materials in Electronics; Apr2014, Vol. 25 Issue 4, p1687-1695, 9p