Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Toshio Sasao"'
Autor:
Daisuke Kitayama, Yumi Okazaki, Ryohei Kasai, Kouji Sakamoto, Shouhei Yamada, Jyunichi Suyama, Toshio Sasao, Satoru Kuramochi, Hiroaki Sato, Haruo Iida, Hiroshi Kudo, Mitsuhiro Takeda
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Aggressive scaling down of the Cu trace pitch in the redistribution layer (RDL) is needed to meet the design rule for high-density I/O used in advanced packaging. Such a downsized RDL, however, will be vulnerable to voltage and current stresses, in a
Autor:
Daisuke Kitayama, Miyuki Akazawa, Hiroyuki Sato, Masaya Tanaka, Kouji Sakamoto, Hiroshi Mawatari, Yumi Okazaki, Ryohhei Kasai, Hiroshi Kudo, Shouhei Yamada, Toshio Sasao, Susumu Tashiro, Naoki Oota, Satoru Kuramochi, Haruo Iida, Takamasa Takano, Mitsuhiro Takeda, Jyunichi Suyama
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electri
Publikováno v:
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.
We have developed new biochemical IC chip-set which realizes real-time PCR in the finger top size. Unlike conventional mu-TAS approach, our chip-set has great versatility and portability since all chips are designed in standardized micro-architecture
Publikováno v:
The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec). 2009:2A2-L05_1