Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Toshio Enami"'
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 8:127-137
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15e573dd807dd56b34f88358d772c13e
https://doi.org/10.5104/jiepeng.8.127
https://doi.org/10.5104/jiepeng.8.127
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Relationship between the stress of ICs and package warpage caused by flip-chip bonding is evaluated using piezoresistor chip and is measured by Moire measurement method. The die size is 9×9 mm2 with 200µm and 550µm in thickness. After non-conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b72594222af15425aeab2eb17eff6fdf
https://doi.org/10.1109/icep.2016.7486871
https://doi.org/10.1109/icep.2016.7486871
Autor:
Mori Takashi, Masayuki Kawase, Nobuhiro Imaizumi, Ryoji Tanimoto, Takeda Kohei, Toshio Enami, Taiji Sakai, Masataka Mizukoshi
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001701-001730
We have developed Cu-Cu/adhesives hybrid bonding technique by using collective cutting of Cu bumps and adhesives in order to achieve high density 3D-SIC. It is considered that progression of fine pitch interconnection leads to lower height of bonding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::634ab5eb638c6c40aff71062e7906cec
https://doi.org/10.4071/2012dpc-wp12
https://doi.org/10.4071/2012dpc-wp12
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The stress of integrated circuits caused by flip-chip bonding (FCB) is evaluated using piezo-sensor embedded test element group (TEG) chips. After non-conductive film (NCF) coating, the TEG chips are connected to the organic substrate and silicon int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a87a461647f6ef64d52869aee2c8b0d4
https://doi.org/10.1109/eptc.2015.7412265
https://doi.org/10.1109/eptc.2015.7412265
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
The stress of ICs caused by flip-chip bonding process is evaluated using piezo-resistor embedded test element group (TEG) chips. The TEG size is 9 × 9 mm2 with 550 µm in thickness. After non-conductive film (NCF) coating, the TEG chip is connected
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::305ff891dd0095cf932c96b1abec10bb
https://doi.org/10.1109/icep-iaac.2015.7111119
https://doi.org/10.1109/icep-iaac.2015.7111119
Autor:
Hong Qi Sun, XiangFeng Wang, Tomoyuki Ando, Takeda Kohei, Toshio Enami, Chee Guan Koh, Vempati Srinivasa Rao, Tai Chong Chai, Sharon Pei Siang Lim, Li Yan Siow
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
The use of flip-chip technology in packaging interconnects is becoming more important due to its better electrical performance, smaller form factor packages, and higher interconnect density than wire bonded packages. Flip-chip soldering has been the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b46a7ab30c1660525c4daa4fc706c9e2
https://doi.org/10.1109/eptc.2013.6745778
https://doi.org/10.1109/eptc.2013.6745778
Publikováno v:
Precision Engineering. 21:65-71
This paper deals with a new prototyping method called dot-matrix electrical discharge machining (EDM) with scanning motion. The machining process by the dot-matrix method is similar to printing motion with a dot-impact printer. This method can be app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46a2eef8dccd2bf8645151f85b2333ac
https://doi.org/10.1016/s0141-6359(97)00045-7
https://doi.org/10.1016/s0141-6359(97)00045-7
Publikováno v:
Journal of the Japan Society for Precision Engineering. 63:254-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46f11164541693de8edf7003102cc2ee
https://doi.org/10.2493/jjspe.63.254
https://doi.org/10.2493/jjspe.63.254
Publikováno v:
CIRP Annals. 46:139-142
The quality of the surface machined by electrical discharge machining (EDM) depends on the degree of discharge dispersion. In this paper a dot-matrix EDM with scanning motion is proposed in order to realize rapid prototyping by EDM and to control the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74e002056157b89aa18ad2fc9aa45a8c
https://doi.org/10.1016/s0007-8506(07)60793-8
https://doi.org/10.1016/s0007-8506(07)60793-8
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 9:E16-004
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12bda88540b50f1a649211ce710c693c
https://doi.org/10.5104/jiepeng.9.e16-004-1
https://doi.org/10.5104/jiepeng.9.e16-004-1