Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Toshinori Uemura"'
Publikováno v:
Journal of Lightwave Technology. 36:159-167
This paper gives a detailed description of a >1.3-Tb/s VCSEL-based on-board parallel-optical transceiver module for high-density optical interconnects. The optical module integrates a 28-Gb/s × 24-channel transmitter and receiver into one package wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f4ec090b5582876ef7933da319d95f0
https://doi.org/10.1109/jlt.2017.2766081
https://doi.org/10.1109/jlt.2017.2766081
Autor:
Toshinori Uemura, Masatoshi Tokushima, Mitsuru Kurihara, Kenichiro Yashiki, Yasuhiko Hagihara, Yasuyuki Suzuki, Kazuhiko Kurata
Publikováno v:
IEICE Transactions on Electronics. :148-156
Aiming to solve the input/output (I/O) bottleneck concerning next-generation interconnections, 5 × 5-millimeters-squared siliconphotonics-based chip-scale optical transmitters/receivers (TXs/RXs)— called “optical I/O cores”—were developed. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f550880bd93f235afbec44844ef1143a
https://doi.org/10.1587/transele.e99.c.148
https://doi.org/10.1587/transele.e99.c.148
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
We demonstrate a 28-Gb/s × 24-channel on-board optical transceiver operated under an air-cooling environment. The optical transceiver realizes a data rate density as high as 1.34 Tb/s/inch2 with a total power consumption of 9.1 W. A unique packaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cb10f1b793516c3229cff865b060fa5
https://doi.org/10.1109/icsj.2017.8240059
https://doi.org/10.1109/icsj.2017.8240059
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
We demonstrate >1.3-Tb/s VCSEL-based on-board optical module for high-density optical interconnects. The optical module integrates 28-Gb/s × 24-channel transmitter and receiver into one package of 1-inch^2 footprint. Subsequently, the total data rat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a48bcaad57cd6e6c27cc52266905729
https://doi.org/10.1109/ectc.2017.213
https://doi.org/10.1109/ectc.2017.213
Autor:
Atsushi Izawa, Kazuya Nagashima, Yozo Ishikawa, Naoya Nishimura, Toshinori Uemura, Hideyuki Nasu
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
We report the thermal design of 28-Gb/s × 24-channel CDR-integrated VCSEL-based transceiver optical module for high density optical interconnects. The transceiver module realizes a very high data rate density of 1346 Gb/s/inch2 at a total power cons
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf99453ca236320c5915c31bdea9c5e3
https://doi.org/10.1109/icsj.2016.7801293
https://doi.org/10.1109/icsj.2016.7801293
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
To realize simple and low-cost VCSEL-based parallel-optical modules mounted onto a polymer-waveguide-embedded PCB in high density, we propose a new mounting technology using a guide pin-assisted optical coupling stabilization during a Sn-Ag-Cu solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01324c0b3c15d1180cf5754873495c57
https://doi.org/10.1109/ectc.2016.111
https://doi.org/10.1109/ectc.2016.111
Autor:
Toshinori Uemura, Mitsuru Kurihara, Koichi Takemura, Kenichiro Yashiki, Akio Ukita, Kazuhiko Kurata
Publikováno v:
2015 IEEE CPMT Symposium Japan (ICSJ).
A chip-scale package structure for Si photonic optical transceivers has been developed. The foot print of the transceiver is 5 mm × 5mm. By using an optical pin array and glass interposer with through-glass vias (TGVs), high density optical and elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fea154fa0574d13c5d305d5594e9556
https://doi.org/10.1109/icsj.2015.7357394
https://doi.org/10.1109/icsj.2015.7357394
Publikováno v:
2015 European Conference on Optical Communication (ECOC).
Back reflection from grating couplers can be an obstacle to integrate them with isolator-free light sources. A folded shallow-grating coupler is proposed. We numerically confirmed a back reflection of −27 dB while achieving an upward emitting effic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5904c787d60656d97217f56a9b86b27d
https://doi.org/10.1109/ecoc.2015.7341732
https://doi.org/10.1109/ecoc.2015.7341732
Autor:
Tomofumi Kise, A. F. Rizky, Yoshinobu Nekado, Hideyuki Nasu, Toshinori Uemura, Naoya Nishimura, Yozo Ishikawa, Kazuya Nagashima
Publikováno v:
SPIE Proceedings.
The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications. We introdu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52afa7b45995549c4974d61664ca3619
https://doi.org/10.1117/12.2078757
https://doi.org/10.1117/12.2078757
Autor:
Ichiro Ogura, Koichi Takemura, Masatoshi Tokushima, Jun Inasaka, Yasuhiko Hagihara, Makoto Fushimi, Yasuyuki Suzuki, Takaaki Nedachi, Junichi Tsuchida, Kenichiro Yashiki, Makoto Okano, Toshinori Uemura, Jun Ushida, Shigeki Takahashi, Kazuhiko Kurata, Akio Ukita, Daisuke Okamoto, Mitsuru Kurihara, Junichi Fujikata, Takanori Shimizu
Publikováno v:
OFC
We developed 5 mm square Si-photonics-based chip-scale optical transmitters/receivers called “optical I/O cores”. The power consumption of their hybrid-integrated ICs is 5 mW/Gbps. We demonstrated 25-Gbps/ch error-free operation over 300-m MMF in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::365d7432d0035ed5178e6164a15b5ed4
https://doi.org/10.1364/ofc.2015.th1g.1
https://doi.org/10.1364/ofc.2015.th1g.1