Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Toshinori Koyama"'
Autor:
Toshinori Koyama, Manabu Nakamura, Yuji Kunimoto, Atsunori Kajiki, Masayuki Mizuno, Kosuke Tsukamoto, Shinji Nakazawa
Publikováno v:
International Symposium on Microelectronics. 2019:000381-000386
Heterogeneous packaging is one of the advanced technologies. Especially for high-end applications such as data center server, HPC and Artificial-Intelligence (AI), High-Bandwidth Memory (HBM) integration is a key and strongly required. As we know, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47b1ae4bd78c99a375431482e2aff979
https://doi.org/10.4071/2380-4505-2019.1.000381
https://doi.org/10.4071/2380-4505-2019.1.000381
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:367-373
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dae4657f8c76d35f5ec9802b72c7c722
https://doi.org/10.5104/jiep.22.367
https://doi.org/10.5104/jiep.22.367
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Recently, 2.5D package structure such as using silicon interposer is used for high end sever and HPC (High Performance Computing) with high density connection between logic device and memory device. We are developing high density organic package call
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd33bde4a9c3db6878ec76954233fec4
https://doi.org/10.1109/ectc.2019.00246
https://doi.org/10.1109/ectc.2019.00246
Publikováno v:
International Symposium on Microelectronics. 2014:000382-000387
This paper describes the development of a Glass-Interposer (Glass-IP) with 40um-pitch Cu micro- bumps. It features fine Cu wiring on the front side, Through-hole Glass-Vias (TGV), and a Re-distribution layer (RDL) on back side. After first explaining
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24fde6b9706a171bdf490c24d3add5d6
https://doi.org/10.4071/isom-wa12
https://doi.org/10.4071/isom-wa12
Autor:
Shoji Watanabe, Zafer Kutlu, Takashi Kurihara, Kiyoshi Oi, Yuji Kunimoto, Satoshi Otake, Lavanya Aryasomayajula, Masato Tanaka, Toshinori Koyama, Noriyoshi Shimizu
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
2.5D packaging technology utilizing silicon interposers is being developed and used for high-performance applications as the demand for miniaturization and higher density continues to increase. Silicon interposers enable very high density interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3afc79ebfc1850b4b3e36a48cc768c0
https://doi.org/10.1109/ectc.2014.6897310
https://doi.org/10.1109/ectc.2014.6897310
Autor:
Naoyuki Koizumi, Wataru Kaneda, Noriyoshi Shimizu, Hiromu Arisaka, Satoshi Sunohara, Toshinori Koyama, Akio Rokugawa
Publikováno v:
International Symposium on Microelectronics. 2013:000414-000414
In recent years, it has become apparent that the conventional FC-BGA (Flip Chip Ball Grid Array) substrate manufacturing method (Electroless Cu plating, Desmear, Laser Drilling processing) is reaching its limits for finer wiring dimensions and narrow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac57f615cf484b8713823613e2d7b830
https://doi.org/10.4071/isom-2013-tp65
https://doi.org/10.4071/isom-2013-tp65