Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Toshihisa Nonaka"'
Autor:
Toshihisa Nonaka
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 26:211-219
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5041ae6ee306f9a8f975d107a2ec9abb
https://doi.org/10.5104/jiep.26.211
https://doi.org/10.5104/jiep.26.211
Autor:
Toshihisa Nonaka
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:380-384
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2d3aaa3b56cf51ee8f9aae47fd9dcf0
https://doi.org/10.5104/jiep.22.380
https://doi.org/10.5104/jiep.22.380
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
This work presents the imprint-thorough mold via (i-TMV) concept applicable for compartmental level electromagnetic interference (EMI) shielding. The i-TMV structure could be successfully fabricated by imprinting with the silicon master and filling w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbcdc6a553c6abcb3ba54f0e7cb4f5dc
https://doi.org/10.1109/estc48849.2020.9229755
https://doi.org/10.1109/estc48849.2020.9229755
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The imprint-Through Mold Via was proposed for electromagnetic interference (EMI) shielding of Antenna in Package (AiP) application. The 300 μm-height via array could be successfully imprinted by using the silicon master which has 743 pillars with th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24d012c1c003bdfcd70b50a6830aa0a3
https://doi.org/10.1109/ectc32862.2020.00032
https://doi.org/10.1109/ectc32862.2020.00032
Autor:
Hiroyuki Kuwae, Toshihisa Nonaka, Jun Mizuno, Takumi Kamibayashi, Hirokazu Noma, Shuichi Shoji, Naoya Suzuki
Publikováno v:
Journal of Electronic Materials. 47:5403-5409
Copper-copper (Cu-Cu) direct bonding assisted by direct immersion gold (DIG) was demonstrated. Cu-Cu direct bonding is a critical technology for inductively coupled memory interconnections. To solve the problems of conventional methods of Cu-Cu direc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2265fc7b8594ff7641c8c5e27a901378
https://doi.org/10.1007/s11664-018-6428-x
https://doi.org/10.1007/s11664-018-6428-x
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Die shift and passive component drift were the issues of the fabrication of die-first face-down type FO-PLP. Those were investigated in the making process of 515 mm x 510 mm size test vehicle. It was found that there was a strong correlation between
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e8a4c39324535dca05177d1c76e6d25
https://doi.org/10.1109/impact47228.2019.9024997
https://doi.org/10.1109/impact47228.2019.9024997
Publikováno v:
3DIC
Warpage and solder joint reliability of 2.5D and fan-out packages were investigated using Finite Element Method comparing with the flip chip package. It revealed that the warpage could be reduced to about 50% and the solder joint reliability could be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::944b41324f9a71a6c9ea53028e2fe499
https://doi.org/10.1109/3dic48104.2019.9058902
https://doi.org/10.1109/3dic48104.2019.9058902
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Non-conductive film fillet control during the thermal compression bonding using a multi laser beam bonder was investigated comparing with the case of using a conventional ceramic pulse heater bonder. The laser bonder can control each laser beam power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b0bc88980c48e212d687b415c4d2a04
https://doi.org/10.1109/ectc.2019.00074
https://doi.org/10.1109/ectc.2019.00074
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Low dielectric loss non-conductive film has been developed. The dielectric dissipation factor was 0.006. In the assembly process, non-conductive film afforded both excellent lamination-ability to the bumped wafer and dicing-ability of non-conductive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c8afda0e78411ea6779c48402ed1830
https://doi.org/10.1109/ectc.2019.00117
https://doi.org/10.1109/ectc.2019.00117
Autor:
Shuichi Shoji, Yoichi Shinba, Masatsugu Nimura, Toshihisa Nonaka, Masaki Ohyama, Akitsu Shigetou, Jun Mizuno
Publikováno v:
Microelectronics Reliability. 59:134-139
In this paper, we describe hybrid bonding technology of single-micron pitch with planar structure for three-dimensional (3D) interconnection. Conventionally, underfill method utilizing capillary force was used after the bonding of microbump. However,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbc46d07a4376a7d9f9527b4788b6d1c
https://doi.org/10.1016/j.microrel.2015.12.033
https://doi.org/10.1016/j.microrel.2015.12.033