Výsledky vyhledávání - "Toshiaki Shibata"

Akademický článek

The impact of deprivation on colorectal cancer‐stage distribution in a setting with high hospital bed density: A Japanese multilevel study

Autor: Toshiaki Shibata, Daisuke Shinjo, Kiyohide Fushimi

Publikováno v: Cancer Medicine, Vol 13, Iss 14, Pp n/a-n/a (2024)

Abstract Background A methodology for determining the appropriate balance between medical access and combating poverty remains undetermined. To address the boundary conditions for exceedingly good medical access, this study examined whether the impac

Externí odkaz: https://doaj.org/article/215e3b1fa4554b7f840b7706d70184a1

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Akademický článek

Pandemic‐resilient target setting in colorectal cancer screening for vulnerable older population

Autor: Toshiaki Shibata, Daisuke Shinjo, Junichi Takahashi, Kiyohide Fushimi

Publikováno v: Cancer Medicine, Vol 12, Iss 1, Pp 619-630 (2023)

Abstract Background Colorectal cancer screening (CRCS) needs to be pandemic‐resilient to avoid long‐lasting shutdowns; however, realistic participation target remains unelucidated. This study aimed to identify the lowest acceptable participation

Externí odkaz: https://doaj.org/article/2bc076dc1066449288411171f03548e1

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Pandemic-resilient target setting in colorectal cancer screening for vulnerable older population

Autor: Toshiaki Shibata, Daisuke Shinjo, Junichi Takahashi, Kiyohide Fushimi

Publikováno v: Cancer medicineREFERENCES.

Colorectal cancer screening (CRCS) needs to be pandemic-resilient to avoid long-lasting shutdowns; however, realistic participation target remains unelucidated. This study aimed to identify the lowest acceptable participation rate in CRCS during a pa

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4e37aa63533ab51e365532033b0a0cb5
https://pubmed.ncbi.nlm.nih.gov/35666024

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Barrier properties of electroless deposit of Co-W-P alloy

Autor: Toshiaki Shibata, Sho Kanzaki, Yukinori Oda, Shigeo Hashimoto, Seigo Kurosaka

Publikováno v: 2019 International Conference on Electronics Packaging (ICEP).

It is known that the Co alloy deposit has high electromigration resistance and thermal diffusion resistance to Cu. We could prepare electroless deposit of Co-W-P with different W contents on Cu substrate by changing the Co-W-P bath parameter. After h

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::15e62eb75d8d2e04fce6db1418d4a1b9
https://doi.org/10.23919/icep.2019.8733487

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3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

Autor: Fuya Nagano, Shigeo Hashimoto, Inge De Preter, Gerald Beyer, Toshiaki Shibata, Eric Beyne, Jaber Derakhshandeh, Lin Hou, Samuel Suhard, Andy Miller, Pieter Bex, Ruben R. Lieten, S. H. Sharifi, Yukinori Oda, Kenneth June Rebibis

Publikováno v: 2017 IEEE International Interconnect Technology Conference (IITC).

To improve the performance of 3D electronic chips, dense I/O and interconnects are required. Increasing the density of interconnects requires smaller pitch micro-bumps. However, when scaling down microbumps several challenges have to be taken into ac

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c4b6b7a8218545476e2808c8fd800f88
https://doi.org/10.1109/iitc-amc.2017.7968950

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