Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Torsten Thelemann"'
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
The paper presents actual results and applications of the developed picosecond laser structuring technology for low temperature cofired ceramics (LTCC). Standard screen-printed thick films on LTCC are ablated in the green and fired state for buried s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b8d6a259b2f03ead753bfa537078e6c
https://doi.org/10.23919/empc44848.2019.8951813
https://doi.org/10.23919/empc44848.2019.8951813
Publikováno v:
International Symposium on Microelectronics. 2016:000581-000585
Rising operating temperatures, environmental restrictions, harsh conditions around our electronics, shortage of space, expectations for long-term reliability and cost are some of the driving forces we all have to deal with during electronics design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c1c3e97a42794e404f2c6c2da8f8151
https://doi.org/10.4071/isom-2016-thp23
https://doi.org/10.4071/isom-2016-thp23
Autor:
Torsten Thelemann, Mario Pauli, Benjamin Goettel, Christoph Heine, Thomas Zwick, Akanksha Bhutani, Heiko Gulan
Publikováno v:
2016 10th European Conference on Antennas and Propagation (EuCAP).
An aperture-coupled stacked patch microstrip antenna based on Low-Temperature Co-fired Ceramic (LTCC) technology is presented in this paper. Inspite of using an antenna substrate with high permittivity of 7.1 and only 200 µm thickness, wide bandwidt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcaab016f5b7220040ba680f2edc433c
https://doi.org/10.1109/eucap.2016.7481147
https://doi.org/10.1109/eucap.2016.7481147
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000334-000338
Electroless plating on silver is a low cost alternative to printing of mixed metals or pure gold paste systems on LTCC. It overcomes the necessity to have material transitions from inner to outer layers or from conductor lines to wire bonding- or sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b006ec057b73994a59e93cbc4d054462
https://doi.org/10.4071/cicmt-2012-wa32
https://doi.org/10.4071/cicmt-2012-wa32
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 4:167-172
The material properties of low-temperature co-fired ceramics (LTCCs) enable new application areas beyond the use as basic material for high-density circuits. Therefore, LTCCs are increasingly used for microfluidic applications. A modular LTCC-based m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5b8a31e5a525003eb968a4f2a560e5b
https://doi.org/10.4071/1551-4897-4.4.167
https://doi.org/10.4071/1551-4897-4.4.167
Publikováno v:
J. of Electrical Engineering. 3
Semiconductors are running in Moore's beat bringing out impressively small processor, memory, amplifier and sensor chips. However, their packaging is more often the challenge for developers and system designers. The paper describes requirements and s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ae5b42ad3eae499ee321a53484ca920
https://doi.org/10.17265/2328-2223/2015.03.005
https://doi.org/10.17265/2328-2223/2015.03.005
Publikováno v:
Microelectronics International. 19:19-23
A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies. Reasons for choosing LTCC‐Technology may be financial considerations or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c4729d20328d74490bdbb0ca4987921
https://doi.org/10.1108/13565360210445005
https://doi.org/10.1108/13565360210445005
Publikováno v:
Scopus-Elsevier
A thick film anemometer for in situ control of the flow rate in fluidic systems was designed, manufactured and characterized. The sensor is integrated in a retention modulus consisting of Low Temperature Cofired Ceramics (LTCC). These materials allow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbcd0b6be56984d19688094d55a8249b
https://doi.org/10.4028/3-908158-11-7.401
https://doi.org/10.4028/3-908158-11-7.401
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