Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Torsten Hauck"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d83e8894ad6249b99369d089785e4e6
https://doi.org/10.1109/eurosime56861.2023.10100850
https://doi.org/10.1109/eurosime56861.2023.10100850
Autor:
Yaxiong Chen, Torsten Hauck, Abdullah Fahim, Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::581b70f8bff8e0257ab5c35c87308384
https://doi.org/10.1109/eurosime54907.2022.9758905
https://doi.org/10.1109/eurosime54907.2022.9758905
Autor:
Alexander B. Freidin, Wolfgang H. Müller, V. A. Klinkov, Torsten Hauck, A. V. Semencha, Aleksandr Morozov
Publikováno v:
Journal of Electronic Materials. 49:7194-7210
In this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee052134c8bb45cf856e764c785c0120
https://doi.org/10.1007/s11664-020-08433-y
https://doi.org/10.1007/s11664-020-08433-y
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Current electronic devices and features sizes are becoming smaller, lighter, with ever-increasing electrical performance requirements. For flip chip devices, Cu-pillar technology enables reduced pitch and reduced package size with good electrical per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9c448baf4dc4c86fe9afb7981c39fed
https://doi.org/10.1109/eurosime52062.2021.9410879
https://doi.org/10.1109/eurosime52062.2021.9410879
Autor:
Cheong Chiang Ng, Torsten Hauck
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
An efficient thermal simulation flow for a package interconnected system at transient operating condition is demonstrated with full spatial and time resolution. Compact thermal models were developed as building blocks for virtual assembly of electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8995213db6a0cf922df9c4cd47fc38a
https://doi.org/10.1109/icsj47124.2019.8998660
https://doi.org/10.1109/icsj47124.2019.8998660
Autor:
Torsten Hauck, Vibhash Jha
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Virtual prototyping is the way forward to shorten development cycles and deliver optimized design solutions for semiconductor components and electronic modules. It allows us to make virtual experiments for devices that have never been built before. W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97a7ba0725785a0cf28c57de1acb4847
https://doi.org/10.1109/itherm.2019.8757439
https://doi.org/10.1109/itherm.2019.8757439
Autor:
Torsten Hauck, Vibhash Jha
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Virtual prototyping is the way forward to shorten development cycles and deliver optimized design solutions for semiconductor components and electronic modules. It allows us to make virtual experiments for devices that have never been built before. W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b52849476009f25ba4094f26e01f6ce
https://doi.org/10.1109/eurosime.2019.8724572
https://doi.org/10.1109/eurosime.2019.8724572
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper is concerned with the modeling of InterMetallic Compound (IMC) formation in tin (Sn) based solders on copper (Cu) interconnects. IMC formation is the result of diffusion and chemical reaction processes. There is a change in shape and volum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::971dea2cbba4866b920f5e8d9265d487
https://doi.org/10.1109/eurosime.2018.8369860
https://doi.org/10.1109/eurosime.2018.8369860
Autor:
Vibhash Jha, Torsten Hauck
Publikováno v:
International Symposium on Microelectronics. 2015:000179-000184
A study has been conducted for epoxy mold compound filling for a 48 lead exposed pad package. The leadframe design contains a small gap feature where it is critical to evaluate void estimates. A modeling method is being discussed to accurately predic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c03047c5e69552feee088f8b11bc5e5
https://doi.org/10.4071/isom-2015-tp65
https://doi.org/10.4071/isom-2015-tp65
Autor:
David Samet, Ilko Schmadlak, Suresh K. Sitaraman, Torsten Hauck, Sandeep Shantaram, Nishant Lakhera, V. N. N. Trilochan Rambhatla
Publikováno v:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Fracture mechanics is an essential field of study towards the improvement and development of electronic packages. In combination with modern simulation method such as finite element analysis (FEA), fracture mechanics is widely used and appreciated in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7e949dad4b8ce22549e88f45234c4c8
https://doi.org/10.1115/ipack2017-74073
https://doi.org/10.1115/ipack2017-74073