Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tony Gong"'
Publikováno v:
International Symposium on Microelectronics. 2019:000001-000005
System in Package (SiP) modules provide integrated functionalities (processor, memory, power, etc.) in a small form factor as compared to PCB based individually laid out packages and passives. SiP modules face assembly related challenges as the compl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7258c2358a8a13ac9cf6ed1f74ed27bd
https://doi.org/10.4071/2380-4505-2019.1.000001
https://doi.org/10.4071/2380-4505-2019.1.000001
Autor:
Yap Weng Foong, Doug Mitchell, Tony Gong, Scott M. Hayes, Michael B. Vincent, Jason R. Wright
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001458-001485
Recent development efforts for fan-out wafer level packaging (FO-WLP) have focused on system-in-package (SiP) solutions using both 2D and 3D packaging structures. Creating connections between the various elements of the system is one of the critical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccb12b00c6509bf681ef183f0d451165
https://doi.org/10.4071/2013dpc-wp22
https://doi.org/10.4071/2013dpc-wp22
Autor:
Dominic Koey, George R. Leal, Gao Wei, Tony Gong, Scott M. Hayes, Jason R. Wright, Tony Vessa, Doug Mitchell
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001105-001125
The start-up of the 300mm RCP prototype production line using automated tools was challenged by significant differences in tool sets when compared to the manual and semi-automatic lab based equipment used to develop the baseline RCP fabrication proce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc8cd968a6c83bbf907223e85d1d0474
https://doi.org/10.4071/2011dpc-tp35
https://doi.org/10.4071/2011dpc-tp35