Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tony Chia-Yu Peng"'
Autor:
Tony Chia-Yu Peng, John H. Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Bruce Puru Lin, Tim Xia, Leo Chang, Hsing-Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:469-478
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef1462fe60f93e69f4abb75639bcedb3
https://doi.org/10.1109/tcpmt.2022.3151848
https://doi.org/10.1109/tcpmt.2022.3151848
Autor:
Tim Xia, Cheng-Ta Ko, David Cheng, Kai-Ming Yang, John H. Lau, Leo Chang, Tzyy-Jang Tseng, Eagle Lin, Tony Chia-Yu Peng, Hsing Ning Liu, Puru Bruce Lin
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1110-1124
In this study, a very high-throughput and low-cost packaging method for fabricating the fan-in chip-scale package is presented. Emphasis is placed on the utilization of the existing printed circuit board (PCB) panel carriers and the corresponding PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c47a77cd9f2b8e31723a1552085a3f4
https://doi.org/10.1109/tcpmt.2020.2996255
https://doi.org/10.1109/tcpmt.2020.2996255
Autor:
Tzu Nien Lee, John H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Henry Kai-Ming Yang, Puru Bruce Lin, Tony Chia-Yu Peng, Leo Chang, Jia Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng
Publikováno v:
2021 IEEE CPMT Symposium Japan (ICSJ).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc94d863fa43cf8d7afff3725c28003c
https://doi.org/10.1109/icsj52620.2021.9648855
https://doi.org/10.1109/icsj52620.2021.9648855