Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Toni Youssef"'
Autor:
Fatme Abed Ali, Yvan Avenas, Pierre Lefranc, Pierre Olivier Jeannin, Hadi Alawieh, Toni Youssef, Hassan Moussa
Publikováno v:
Materials Science Forum. 1062:637-641
Compactness, efficiency, and light weight are the key topics in the design of power conversion systems for transportation applications. This demand is achievable by using wide band gap devices such as SiC devices, characterized by the high switching
Autor:
Arnaud Escriva, Sombel Diaham, Vincent Bley, Zarel Valdez-Nava, Trong Trung Le, Toni Youssef, Rabih Khazaka, Stephane Azzopardi
Publikováno v:
2022 IEEE 4th International Conference on Dielectrics (ICD).
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 16:182-187
The rapid and localized heating techniques allow the joining of temperature-sensitive materials and components without thermal induced damage commonly encountered when high-temperature solder reflow processes are used. This is also advantageous for m
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000016-000021
In this paper, in order to assemble electronic components onto substrates, a local rapid soldering process using an exothermic reactive foil sandwiched between solder preforms was evaluated. Among others, the main interest of this technique is that i
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, pp.113900-. ⟨10.1016/j.microrel.2020.113900⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113900-. ⟨10.1016/j.microrel.2020.113900⟩
PCB-Embedding technology is an established approach for the miniaturization of electronic systems and modules. Silver sintering, which is a reliable alternative to Lead-Free Bonding, is used to assemble the embedded power components in the PCB. Therm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9013527fb32ca1d617862213dccac64b
https://hal.archives-ouvertes.fr/hal-03492725
https://hal.archives-ouvertes.fr/hal-03492725
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, pp.113891-. ⟨10.1016/j.microrel.2020.113891⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113891-. ⟨10.1016/j.microrel.2020.113891⟩
This study deals with the reliability of a new power embedded PCB (printed circuit board) concept highly integrated into an electrical machine for aeronautical and automotive applications. The first part of this paper describes the assembly topology.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf3e8ac73fadc79b197200d294579343
https://hal.archives-ouvertes.fr/hal-03492797
https://hal.archives-ouvertes.fr/hal-03492797
Autor:
Stephane Azzopardi, Rabih Khazaka, Jean Sylvio Ngoua Teu, Sara Roggia, Toni Youssef, Bertrand Revol, Cyrille Gautier
Publikováno v:
IECON
This paper gives a general overview of the main technology bricks proposed for Wide Band Gap (WBG) power converters to face the challenges in the aerospace field recently introduced by the concepts of More Electrical Aircraft (MEA) and More Electrica
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The market introduction of high temperature wide bandgap electronics power semiconductor devices with junction temperature exceeding 200°C significantly accelerates the trend towards high power density and severe ambient temperature electronics appl